Electronics Industry News & Analysis | Market Outlook & Trends

Creaform introduces the Pro version of its Scan-to-CAD application module

The application module is designed to streamline and enhance reverse engineering workflows with a more concise approach.

Introducing the new k-Space Knowledge Base

A new resource for metrology and software engineers offers troubleshooting and best practices for thin-film metrology applications.

Advancing electrocaloric research with FLIR thermal imaging at Queen’s University Belfast

The high-speed thermal imaging and advanced analysis tools enabled real-time observation of thermal fluctuations, providing deeper insights into material behavior.

Aetina introduces AI-powered Edge computing innovations at Embedded World 2025

Explore how Aetina’s innovative Edge artificial intelligence (AI) solutions are shaping the future of embedded systems.

Teledyne FLIR’s Black Hornet 4 nano-drone selected as winner of the Defense Innovation Unit’s Blue UAS Challenge

The uncrewed aerial system (UAS) represents the next generation of lightweight nano-drones, able to provide enhanced covert situational awareness to small fighting units.

President Trump calls on ending CHIPS ACT

The act is designed to bring semiconductor manufacturing back to the U.S. domestically.

Verizon expands IoT wireless services to 200 territories

The telecom signs agreements with Singtel and Skylo.

Apple unveils M3 Ultra processor for Macs

The CPU merges a GPU and links two M3 Max dies over 10,000 connections.

Q&A with Christian Jonglas, of Gaia, about their aerospace and defense offerings at Embedded World

Electronics360 recently had the pleasure to converse with Jonglas, technical customer support manager for Gaïa, about their product plans for Embedded World and what he's looking forward to most at the show. With deep technical expertise and a focus on product performance, Gaïa is set to make a significant impact at Embedded World 2025.

Rohde & Schwarz and VIAVI Solutions demonstrate energy efficiency of Analog Devices’ new Titan O-RU at MWC 2025

Attendees can experience the joint O-RU test solution as it verifies the low power consumption of Analog Devices’ new Titan O-RU platform according to ETSI specifications.

The first regenerative 5G mmWave satellite payload

The telecommunication satellites will offer high-speed connectivity and low latency from very low Earth orbit.

Mitsubishi Electric's new robot range supports manufacturing digital transformation

Designed to work in a diverse range of high-speed applications, these SCARA robots are ready to be the high-speed robotic solution for even the most demanding of applications.

Report: Intel delays Ohio fabs until next decade

This comes after delays to its Germany fabs and other cost-cutting measures.

Accelerating radar SoC for ADAS proliferation

GlobalFoundries and Indie Semiconductor are collaborating on automotive electronic components.

MWC 2025: Rohde & Schwarz and Pegatron 5G showcase new O-RU test solution based on the PVT360A

The vector signal generator/vector signal analyzer single-box tester designed specifically for testing radio frequency components, FR1 macro cells and small cell base stations.

Rohde & Schwarz and u-blox validate module compliance with the new Chinese GNSS automotive specification GB/T 45086.1-2024

The Rohde & Schwarz SMBV100B-based Global Navigation Satellite System (GNSS) simulator solution was used to validate module compliance to the new Chinese GNSS automotive specification.

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