Home


    HEADLINES ARCHIVE

  • Avnet Signs Distribution Deal With MiTAC Computing

    Distributor to carry MiTAC's cloud database and computing equipment.

  • DRAM Capacity Expected to Rise in 2016

    DRAM capacity is expected to fall again in 2015, but increase next year to end a six-year decline in DRAM wafer production capacity.

  • SanDisk Hit by Court Injunction on Diablo Chipset

    Memory module supplier Netlist has won a preliminary injunction against Canadian firm Diablo Technologies that also affects the SanDisk Corp. The injunction could help drive an out-of-court settlement.

  • Cadence Rolls IP Processors

    New Tensilica Xtensa processors said to provide up to 75 percent better local memory area and power efficiency while consuming 25 percent less power consumption.

  • Execs Depart AMD

    Three high-ranking executives--including the GM of computing and graphics business group--resign as AMD realigns organization following CEO appointment.

  • Globalfoundries Teams with Linear for IoT, Wearables

    Foundry and chipmaker create analog reference design targeted at meeting the tuning needs for emerging sensors and MEMS that enable the Internet of Things and wearables.

  • Optimal Analysis Algorithms are IoT’s Big Opportunity

    The laser-like focus on the Internet of Things at last week’s Consumer Electronics Show was fitting, given that consumer applications will flood the data pipes while industrial and smart-city IoT concepts trickle along their respective paths.

  • TSMC Sells LED Subsidiary to Epistar

    TSMC, which once had billion-dollar ambitions in LED lighting and solar cells, has sold its LED subsidiary to Epistar for $26 million.

  • CES 2015: The Year of Pragmatism

    The buzz at the Consumer Electronics Show is usually about the next big thing. But this year it was all about what was available right now and ready for purchase.

  • Industrial Flat Cables Tackle Harsh Environments

    Cicoil's flat, high-strength cables said to be immune to shock, vibration, harsh environments and extreme temperatures.

  • SSD Vendors Jump on the PCI Express SSD Train

    Kingston and Plextor introduce solid state drives (SSDs) that support PCI express in order to deliver fast data transfer speeds on PCs.

  • Intel Shipping Streaming TV Stick

    The Compute Stick is a small form factor Windows PC with an HDMI connector that will plug into the back of smart televisions and will directly compete with Google’s Chromecast and Amazon’s Fire TV Stick.

  • MediaTek Rolls SoCs for Android Wearables, TVs

    Taiwanese chip maker announced at CES that its system-on-chips have been integrated into future generations of Android wearable devices and Android televisions.

  • Microsemi Adds Hardware Security to FPGAs

    Defense and communications chip vendor has said it has added hardware security features to two of its product ranges to provide fundamental root of trust for machines, something vital to the Internet of Things

  • Telechips Partners With Sansa for Security

    Agreement will enable digital rights management for Telechips’ Hexa-core based TCC896x chipset for integration into the company’s Smart Stick that will accompany set-top boxes.

  • U.S. Manufacturing Takes a Breather in December

    Due to a West Coast labor strike that caused manufacturing delays, growth was held in check in the month of December. However, the forecast for 2015 is bright.

  • Avnet Consolidates Japanese Units

    Distributor merges Japanese units into single business in an effort to better service electronics OEMs and electronics manufacturing services providers and to improve productivity.

  • CES: Intel Shows Curie 'Button' for Wearables

    At CES Intel's CEO showed off a Quark-based button-sized wireless sensor module that includes pattern matching. He also announces $300 million initiative to hire and retain women and those from other under-represented groups.

  • Molex Acquires Canadian Wireless Components Firm

    Montreal-based SDP Telecom designs and builds complex surface mount passive microwave structures, and sophisticated sub-assemblies.

  • ON Semi Unveils 13-Megapixel Smartphone Image Sensor

    The image sensor is based on 1.1 micron pixel technology and supports both 4k ultra-high definition and full HD and is already being designed into next-generation smartphones.

Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement