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Energy harvesting Bluetooth LE 5.3 module unveiled
GlobalScale and Atmosic’s new device is now available.
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Autonomous Auto Engineering (November 5-11)
These impressive systems remain future vision. Nonetheless, electronics and automotive engineers continue to push the technological frontier so that one day, likely in the next couple of decades, everyone will be a passenger.
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Arduino SBCs now supported through Avnet’s design network
The collaboration will accelerate product development.
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US further expands export restrictions to China
This time restrictions will include AI semiconductors.
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Littelfuse launches world’s smallest subminiature flange mount reed sensors for various applications
These sensors are ideal for appliances, security/access control and factory automation where space is limited.
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Micron to expand test factory in Malaysia
The assembly and test facility will see an additional $1 billion investment.
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ECIA: Disappointing drop in sales in September for electronic components
But October is a positive outlook.
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Rohde & Schwarz participates in project to strengthen microelectronics and communications technologies in Europe
The project aims to develop a new, highly competitive European test and measurement solution for the millimeterwave range.
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AMETEK Land launches enhanced SPOT+ pyrometer range with improved communication interfaces
New enhancements offer improved connectivity for easy integration with control systems, and the confidence that data transmission is secure.
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Rohde & Schwarz showcases mobile and wireless test solutions at MWC Kigali
The company showcases a selection of its test solutions addressing applications in high demand by the mobile industry in Africa.
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SECO at SPS 2023: Computer-on-modules for demanding industrial applications
Developers can use SECO's computer-on-module systems to develop powerful industrial solutions for the most demanding requirements in the shortest possible time.
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Comau powers the efficient automation production of next-generation electric drive systems for NIO
The advanced manufacturing environment includes primary e-motor assembly lines, gearbox manufacturing lines and inverter assembly lines as well as End of Line testing processes.
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Littelfuse launches high amperage rating fuse blocks for 5 x 20 mm fuses
The fuse blocks are available in surface- and through-hole mount options to support more demanding applications.
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Combating the risks and scale of disasters with innovative image processing
Here is how industrial cameras are increasingly used for research and prevention of environmental damage associated with natural disasters.
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Compact and connected: 3D-circuits revolutionizing wearable medical devices
The manufacturing technology integrates circuits directly into 3D thermoplastic substrates to miniaturize and optimize hearing aids and other medical wearables.
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TechInsights Teardown: Magic Leap 2 AR headset
A partial deep dive into mixed reality device.
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Highly configurable 32-bit MCU with embedded hardware security module
The devices are available with a 300 MHz Arm Cortex-M7 processor and a wide range of connectivity and Flash memory options for added flexibility.
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Menlo Micro releases a superior high frequency ideal switch signal relay solution for DC, analog and RF applications
The single component solution combines the high isolation of a traditional low-signal mechanical relay and the reliability of a semiconductor relay.
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Littelfuse unveils SZSMF4L automotive grade 400-Watt TVS diodes in surface mount package
The diodes protect automotive electronics with fast response time, low Zener impedance, high surge handling and excellent clamping capabilities.
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SIL2/SIL3: The safety level for mobile vehicles
These safety encoders can be used in applications where safety is particularly critical, such as public road transport.
