Product Watch

Macdermid Alpha has been awarded for innovation: driving process optimization and efficiency with major Indian EMS provider.

From vintage chrome to family heirlooms, Simichrome Polish is the go-to choice for pros and DIYers alike. Trusted across homes, garages, and workshops, it delivers a flawless finish on brass, silver, gold, chrome, and more.

Our innovative 2-in-1 conductive thermal pad combines EMI shielding and thermal management in a single solution for BMS. It eliminates separate materials, simplifies assembly, reduces BOM complexity, and enhances reliability in EVs. This space-saving technology ensures optimal thermal performance and electromagnetic protection.

Direct-to-chip cooling leaves no room for sloppy interfaces. This thermal gel stays put at the GPU-to-cold plate interface, helping maintain stable contact and reliable server performance under flow and vibration.

Without the need for wiring harnesses and terminal connections, the structure can be simplified and the size of the lamp body can be reduced. The connection between the flexible board and the substrate is achieved through a lamination process followed by soldering, which is more secure than terminal connections.

Ensure long-term reliability of LiDAR sensors with our thermally conductive, silicone-free pads. They prevent silicone vapor contamination that can distort optical lenses and signals, guaranteeing accurate perception and safer autonomous navigation in all conditions.

When designing the PCB, you may find that 4 or 6 layers are not enough. Our 8-Layer PCBs are the ideal solution, as it has two additional signal layers than 6-layer PCBs to optimize the arrangement of power and ground planes, thus they can reduce the potential for electromagnetic interference and crosstalk.

As the demand for faster, smaller, and more energy-efficient devices grows, the semiconductor industry is under increasing pressure to innovate—not just for performance, but for sustainability. This article dives into the cutting-edge materials and manufacturing strategies that are enabling next-generation chips while reducing environmental impact.