Product Watch

Materials

  • LiPOLY® Two-Part Thermal Conductive Gap Filler

    Supplier: Shiu Li Technology Co., Ltd
    LiPOLY® BS04 is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K. It is ideally suited for dispensing using the dispensing robot or by syringe.
  • Thermal Solutions for Automotive Electronics

    Supplier: Fujipoly® America Corp.
    In addition to our many years of experience for motor vehicles, we will contribute to society with products such as Fujipoly’s heat-dissipating sheets in technological innovations such as electrification and autonomous driving of motor vehicles that will continue to evolve in the future.
  • Structural Epoxy Meets ISO 10993-5

    Supplier: Master Bond, Inc.
    Toughened, high strength, two component epoxy for bonding and sealing, meets ISO 1099305 for non-cytotoxicity.
  • LiPOLY® Thermal Conductive Putty with 13.0 w/m*k

    Supplier: Shiu Li Technology Co., Ltd
    LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. DTT13 is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. It also can overcome overflow and drying problems to increase the thermal conductivity.
  • Thermal Conductive Putty S-putty5-s

    Supplier: Shiu Li Technology Co., Ltd
    Applications: Between CPU and heat sink Between a component and heat sink High speed mass storage drives Telecommunication hardware Flat-panel displays Set-top box IP CAM
  • High performance casting resins & potting resins.

    Supplier: ELANTAS PDG, Inc.
    asting and potting resins for light and heavy electrical applications CONAP®, ELAN-Cast®, and ELAN-Tron® resins from ELANTAS PDG, Inc. guarantee optimum protection of electrical machines operating in challenging environments and offer a broad spectrum of mechanical, electrical, and self-extinguishing properties.
  • Thermal Conductivity 4 Times Greater Than Copper!

    Supplier: MINTEQ® International Inc, Pyrogenics Group
    Pyroid® HT is an engineered carbon product that has in-plane thermal conductivity of 1700 W/m·K which is 4 times greater than the value for copper. In addition to superior heat transfer performance, the density of Pyroid® HT is 75% less than that of copper, allowing for light-weight and high-performance thermal management solutions.
  • Isolation and High Heat Conducting Gel materials

    Supplier: Fujipoly® America Corp.
    Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials. • Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities. • The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements.
  • Cooling electronic components

    Supplier: MINTEQ® International Inc, Pyrogenics Group
    Pyroid® HT is an engineered carbon product that has in-plane thermal conductivity of 1700 W/m·K which is 4 times greater than the value for copper. In addition to superior heat transfer performance, the density of Pyroid® HT is 75% less than that of copper, allowing for light-weight and high-performance thermal management solutions.
  • Lens Bonding Adhesive

    Supplier: Shenzhen DeepMaterial Technologies Co., Ltd
    现代电子设备需要镜头粘接剂。多年来,不同 移动设备的市场已经非常成熟。这导致人们对 功率、功能和外...
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