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Industries
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Vishay Intertechnology IGBT power modules in redesigned INT-A-PAK package reduce conduction and switching losses
New half-bridge insulated-gate bipolar transistor (IGBT) power modules are designed to lower conduction or switching losses in high current inverter stages for transportation, energy and industrial applications.
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ST Microelectronics expands into 3D depth sensing with latest time-of-flight sensors
The company announced a direct time-of-flight (ToF) 3D light detection and ranging module with 2.3k resolution and an early design win for the world’s smallest 500k-pixel indirect ToF sensor.
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Keysight demonstrates 6G neural receiver design flow in collaboration with NVIDIA at Mobile World Congress 2024
External channel models simulated by NVIDIA Sionna are emulated using Keysight equipment to create custom end-to-end system.
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Rohde & Schwarz and SmartViser partner to demonstrate test solutions for new EEI regulation
The partners developed a tailored solution for testing compliance with a new EU Energy Efficiency Index (EEI) label for smartphones and tablets.
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LPWA chipset available from Sony Semiconductor
The module can be used in asset tracks or smart utility meters.
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MWC 2024: Skyworks, Samsung collaborate for next-generation 5G modems
Skyworks’ SKY5 transceiver-to-antenna RFFE module will be integrated into these platforms.
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A sneak peek into Infineon's latest technologies at APEC 2024
Attendees can expect a sensory overload of presentations on power electronics innovations that will electrify their imagination, including Infineon’s new line of power management devices.
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Onsemi introduces 7th gen IGBT based intelligent power modules to reduce energy consumption in heating and cooling
These modules enable more efficient energy conversion and better performance for three-phase inverter drive applications.
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Rohde & Schwarz first to test 5G eCall interoperability of Quectel’s 5G module with its wideband radio communication tester
Quectel Wireless Solutions and Rohde & Schwarz successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules.
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Cambridge GaN devices addresses challenges of data centers and more at APEC 2024
Presentations will address how GaN can play a part in supporting the exponential growth in power demanded by data centers as the use of artificial intelligence proliferates.
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Rohde & Schwarz collaborates with Sony Semiconductor Israel to reach milestones for NTN NB-IoT roll-out
The collaboration achieved the industry’s first 3GPP Rel. 17 Non-Terrestrial Networks Narrow Band-Internet of Things (NTN NB-IoT) radio frequency performance verification.
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Introducing qdPrime: Revolutionizing DisplayPort testing with enhanced capabilities
The software simplifies testing, ensuring performance and improving interoperability.
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Emerson’s new compact, rugged PC built to connect industrial floor to cloud
The industrial computer delivers high-performance computing for industrial edge data visualization applications.
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New InGaAs camera: High resolution, small pixel and low readout noise
The camera functions with sensitivity in the visible to near infrared region from 400 nm to 1,700 nm.
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MSM II AE Metal Line indicators are made of high-grade stainless steel
Like the new MSM II switch family, the indicator version without switching function is available in point, ring or entire surface area illumination.
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Live demo of NR+ 5G coming to Hannover Messe 2024
Four companies will showcase the technology for IIoT applications.
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Triad Micro Devices takes flight for aerospace and defense excellence
The company specializes in cutting-edge, integrated and high-reliability analogue and mixed-signal solutions for terrestrial and space applications.
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Building AI-first autonomous vehicles
ARM and Nuro sign a multi-year agreement for next-generation transportation.
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New LEMO product family portfolio simplifies selection process
The portfolio highlights core series organized into six distinct families based on shared functionality and specific market applications.
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State of the Electronic Supply Chain (March 3-9)
The year 2024 looks to be a critical year for understanding the current status of the electronic component supply chain, which itself is a bellwether for global trade and economies.
