Adesto Technologies, a provider of application-specific, ultra-low power non-volatile memory products, has introduced EcoXiP™, an eXecute-in-Place (XiP) non-volatile memory that replaces expensive, energy-inefficient architectures, making power and performance trade-offs unnecessary in a wide range of connected devices.
EcoXiP™ more than doubles processor performance, lowers system power consumption and reduces system cost compared to standard serial peripheral interface (SPI) devices.
eXecute-in-Place technology holds great promise for small embedded systems because it does not suffer from the disadvantages of executing from on-chip embedded Flash or SRAM. Unlike with embedded Flash, an MCU can be implemented with an external XiP solution using the latest process technologies, leading to better power consumption, higher frequency and lower system cost. Unlike embedded SRAM, an XiP Flash device can be turned off so that it will not consume any power during power-down modes.
In addition, EcoXiP™ offers designers the flexibility of increasing memory capacity as their storage needs increase. However even state-of-the-art XiP solutions suffer from a lack of performance along with high power consumption and increased system cost.
EcoXiP™ brings together all of the advantages of traditional XiP systems over on-chip memory, but its novel architecture means tradeoffs are no longer necessary.
SPI host controllers for EcoXiP™ are available from Adesto IP partners, including Mobiveil and Synopsys.
Samples of Adesto’s EcoXiP™ are available to lead customers now. Adesto is sampling a 32-Mb device at introduction, with a family of densities planned for the future.
