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Aerospace

PCB Technology Achieves Miniaturization Advances

19 September 2016

The DenciTec platform enables the production of high-density circuits without the disadvantages of established manufacturing processes. Source: Cicor The DenciTec platform enables the production of high-density circuits without the disadvantages of established manufacturing processes. Source: Cicor

Cicor, a supplier of printed circuit boards, microelectronics and electronic solutions, has launched a technology platform called DenciTec. DenciTec allows high density of integrated functions for printed circuit boards. Cicor, a supplier of printed circuit boards, microelectronics and electronic solutions, has launched a technology platform called DenciTec. DenciTec allows high density of integrated functions for printed circuit boards.

The DenciTec platform from Cicor enables the production of circuits with extremely high density without the disadvantages of today's established manufacturing processes. Making optimal use of a unique combination of devices at the cutting edge of technology allows highly reliable manufacture of circuits without constraining design freedom.

DenciTec creates the opportunity for further miniaturization. The possibilities include conductor widths and spacings down to 25 µm with copper thicknesses of 20+/–5 µm on all conductive layers, laser-via diameters of 35 µm, annular rings with a diameter of 30 µm for the inner layers and 20 µm for the outer layers, copper-filled blind throughs with the option of stacking, and throughs-in-pads. Furthermore the use of advanced materials allows the production of ultra-thin circuits, including, for example, the manufacture of four-layer flex circuits with a total thickness of less than 120 µm.



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