Semiconductors and Components

Intelligent Power Modules Enable Greener Appliances

24 November 2015

STMicroelectronics has announced a second series of SLIMM family of small low-loss intelligent molded modules in dual-in-line packages. Rated at 600 V, ST’s new intelligent power modules (IPM) are targeting motor drives working up to 20 kHz in hard-switching circuits, enabling an increase in energy efficiency for application power outputs from 300 W to 3 kW.

Source: STMicroelectronicsSource: STMicroelectronicsThe new modules provide a direct connection between a low-voltage microcontroller and a mains-powered electric motor, replacing up to 10 active components. Aside from higher efficiency, the SLLIMM 2nd series IPMs offer increased collector current range and advanced packaging. In fact, improved packaging enables the use of smaller heatsinks.

The SLLIMM 2nd series features an internal configuration with only two drivers—one high-side driver and one low-side driver—and dedicated trench-gate field-stop IGBTs, resulting in an optimal compromise between conduction and switching losses. Plus, the new configuration is designed to ensure robustness and minimizes electromagnetic interference (EMI).

With a maximum collector current ranging from 8 A to 35 A, the IPMs are available in a full molded or direct bond copper (DBC) dual-in-line pin-compatible packages. Internal bootstrap diode is designed to reduce BOM cost and simplifies layout. While 175 °C is the maximum operating junction temperature for the modules, 1500 Vrms is minimum isolation offered by the IPMs. Other features include low VCE(sat), low EMI, separate open emitter outputs to simplify PCB routing for single- and three-phase applications, built-in temperature sensor and NTC option, comparator for fault protection, shutdown input/fault detection output, two pin-out and two lead-frame options.

Most of the members in SLLIMM 2nd series family are in full production, with pricing starting at $9.50, in quantities of 1,000 units.

To contact the author of this article, email engineering360editors@ihs.com



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