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Power Semiconductors

First-time APEC Presence for Mitsubishi Electric

01 March 2018

Source: Mitsubishi Electric U.S., Inc.Source: Mitsubishi Electric U.S., Inc.For the first time, the Semiconductor and Device Division (SDD) of Mitsubishi Electric U.S., Inc. (MEUS), will be exhibiting at APEC, the Applied Power Electronics Conference that runs March 4-8 at the Henry B. Gonzalez Convention Center in San Antonio.

The company’s full line of power semiconductor products will be on display at Booth #919, including:

  • 7th Generation IGBTs
  • G1 Series IPMs
  • Version 6 DIPIPMs (Dual Inline Package Intelligent Power Module)
  • SLIMDIPs (Slim Dual Inline Package)
  • DIPIPM+
  • J1-Series Automotive modules
  • X-Series High Voltage IGBTs (Insulated Gate Bipolar Transistor)
  • SiC (Silicon Carbide) solutions

MEUS’ application engineering team will also present two papers during the conference on Wednesday, March 7. Check the APEC schedule for times and locations.

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