Commentary

Qualcomm Heats Up Chipset Competition

25 February 2015

On Feb. 18, Qualcomm announced a re-branding of its thin-modem product line, incorporating those products under the Snapdragon umbrella, a marked shift away from the former Gobi branding. The company has also announced 4 new processors to address various price points in between the premium and entry-level product tiers. The Snapdragon 620 and 618 are the two additions to the 600 tier while the 425 and 415 are new to the 400 product tier. Three of the four SoCs will have an integrated Cat 7 LTE modem capable of 300 Mbps DL and 100 Mbps UL.

Read More

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

IHS Telecommunications

News articles:



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement