Qualcomm Inc. and Semiconductor Manufacturing International Corp (SMIC) announced they are teaming together to produce 28nm process technology and wafer manufacturing services to be used for Qualcomm’s Snapdragon processors.
The deal will enable SMIC to accelerate its 28nm process maturity and capacity as well as allow the Chinese-based foundry the ability to offer local products based on the latest Snapdragon processors on the 28nm node, both PolysiON and high-k dielectrics metal gate (HKMG).
The manufacturing agreement continues the collaboration between the two companies that previous partnered on power management, wireless and connectivity-related chips across various process technologies. This latest agreement will work to bring new mobile communications products based on 28nm manufacturing to market, indicating Qualcomm believes it may need expanded capacity for Snapdragon chips in the near future.
Furthermore, SMIC said it will extend its technology offerings on 3DIC and RF front-end wafer manufacturing in support of Snapdragon processors as Qualcomm’s portfolio expands.
"This step forward demonstrates SMIC's capabilities and commitments on bringing up the needed advanced node technologies for addressing customers' demands and product roadmaps,” said Dr. Tzu-Yin Chiu, chief executive officer and executive director, SMIC, in a statement. “With Qualcomm Technologies' support, we are confident that our 28nm technologies will become one of the most important growth drivers for the company. We expect that the 28nm product life cycle longevity will exceed previous nodes, which will help better position SMIC to service the needs of Qualcomm Technologies, as well as others."
Qualcomm said the agreement with SMIC will further its manufacturing footprint and services in China as well as help with its regional supply chain strategy.