Acquired Electronics360

Mobile Devices

Samsung SGH-Z150 Mobile Phone Teardown

01 May 2007
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Main Features

This model is a mid-range ultra-slim (9.8mm thick) candybar 3G UMTS (WCDMA) / Tri-Band GSM dual-camera phone (VGA/VGA - yes, hard to believe nothing better!) (no flash) - also features Bluetooth V1.2, USB connectivity, and an unremarkable 1.9 inch 176x220 262K color TFT transmissive screen. Focus feature - 9.8 mm thickness.

Samsung SGH-Z150 Mobile Phone Main ImageSamsung SGH-Z150 Mobile Phone Main Image


In the new post RAZR/SLVR success battle for ultra-slim phones, this phone is on the cutting edge at 9.88mm thickness which is the main feature (a little thinner than SLVR by less than 2mm). Clearly UMTS/WCDMA 3G data rates are also interesting, but Samsung decided on this model to cheap out a bit on the camera modules and did not (unlike the rest of the crop) feature a megapixel camera module in the primary camera slot. Surprisingly this phone features only dual VGA camera modules, which according to some online reviews provide sub-par image quality.

Target Market / Strategy

In a nutshell: SLVR users. This phone is squarely aimed at competing against the SLVR and other new 'slim' segment contenders. This phone is not likely to be the new low-end any time soon with UMTS, but is a mid-range mainstream marketed phone.

Samsung SGH-Z150 Mobile Phone (iSi) - Main PCB TopSamsung SGH-Z150 Mobile Phone (iSi) - Main PCB Top


This phone was announced as part of a broad initiative to design a full contingent of 'thin' phones back in February 2006 per press releases. Actual release date of phone is uncertain.

Pricing / Availability

$200 and up unlocked. Subsidized prices unknown and may vary from service provider to service provider, country to country.

Samsung SGH-Z150 Mobile Phone (iSi) - Enclosure DisassemblySamsung SGH-Z150 Mobile Phone (iSi) - Enclosure Disassembly

Volume Estimations

We are assuming a lifetime production volume of 1.3 million units for this model because of the combination of Samsung's overall market share, assumed share within this phone segment, phone features, etc.

As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', and our meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set. From our most recent revision of this tool iSuppli estimates shipments of 10.3M units of WCDMA 2100 tri-band GPRS (900/1800/1900) handsets in 2006 by Samsung. Furthermore, iSuppli estimates Samsung will Introduce 10 WCDMA 2100 tri-band GPRS (900/1800/1900) handsets in 2006, and 7 in 2005.

Function / Performance

Functional testing was not performed on the Samsung SGH-Z150.

Manufacturing Notes

Country of Origin / Volume Assumptions

As is typically the case with Samsung phones - the product is labeled as Made in Korea. Furthermore, we have assumed that for this model, the PCB was also stuffed in Korea, but that custom mechanicals (plastics and metals) were sourced from China. The charger was also labeled as made in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

The issue of labor rates was revisited in Q2 2006 as we began to apply some research by one the major worldwide EMS suppliers and are now applying some of their research on total loaded costs by country and region to arrive at these new rates which are pronouncedly higher on the low end in China. Remember that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines.

Design for Manufacturing / Complexity

When comparing this WCDMA phone to all of the other WCDMA phones analyzed in the last year this phone, along with the 4 other units analyzed in parallel are basically 5 of the phones with the lowest component counts seen to date. Part of this is due to the fact that this phone and the others against which it was simultaneously analyzed are candybar form factor (vs. sliders or clamshell) designs. This factor primarily affects the mechanical component count and final assembly complexity.

Nonetheless, at a component count of 769 components, of which 114 components are discrete mechanical components, puts this phone at the average point of those WCDMA phones seen in the last year or so. However, the absolute winner seen thus far, and a far cry from this phone in this air interface standard in terms of component counts, is the Nokia 6151. (see 6151 analysis for details).

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

From an electronic design perspective this design bears a great deal of resemblance in core component selection to several other Samsung models, Huawei, Motorola and especially the simultaneously analyzed Benq/Siemens S81 - but specifically bears greatest similarity in component selection to the Samsung SGH-ZV40 previously analyzed.

The use of the 'all-in-one' DBB baseband solution from Qualcomm (MSM6250). This chip really centralizes all of the functionality of the phone including even Bluetooth baseband functionality, as well as GPS functionality. We have also seen the Qualcomm MSM6250 chip in the following models: Vodafone (Huawei) 710, Samsung SGH-ZV40, SGH-Z140V, and SGH-Z150.


  • DBB - Qualcomm - MSM6250A - Quad-Band GSM/GPRS, GPS, UMTS, & Bluetooth, 90nm

Battery / Power Management

  • Power Management IC - Qualcomm - PM6650


  • MCP - Samsung Semiconductor - KBE00F005A-D411 - 1Gb (2 Die x 512Mb) 2.7V NAND Flash, 512Mb (2 Die x 256Mb) 1.8V Mobile SDRAM


  • PAM (GSM) - Skyworks - SKY77328 - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900
  • PAM (WCDMA) - Skyworks - SKY77173 - WCDMA
  • RF Transceiver (GSM/UMTS) - Qualcomm - RTR6250 - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS 800/1900/2100MHz Transmitter
  • RF Receiver - Qualcomm - RFR6250 - ZIF, Dual Band WCDMA (UMTS) 1900 & 2100MHz, GPS
  • Sony - CXG1190EQ - Antenna Switch - GSM/UMTS Dual Mode

User Interface

  • Bluetooth Baseband - In Digital Baseband Processor
  • Bluetooth RF - Murata - PN# Unknown (also used in Samsung SGH-ZX20)
  • FM Sound Synthesizer - Yamaha - YMU765 (from the formerly ever-popular but waning YMU series)


  • 1.9' Diagonal TFT, 262K Color, 176 x 220

Camera Modules

  • Primary - VGA, CMOS, 1/6' Format Fixed Lens
  • Secondary - VGA, CMOS, 1/6' Format Fixed Lens

Samsung SGH-Z150 Mobile Phone (iSi) - Box ContentsSamsung SGH-Z150 Mobile Phone (iSi) - Box Contents

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets