Acer Aspire 5742-7120 Notebook Computer Teardown

Overview / Main Features

The Acer Aspire 5742-7120 is a value notebook computer powered by an Intel Core i3-370M processor and HM55 Express Chipset. This 15.6 inch laptop under analysis is configured with 4GB of DDR3-1333 of memory [on two SO-DIMM modules], a 320GB hard-disk drive, Broadcom 802.11n-capable WLAN module, as well as a lithium ion 6-cell battery. Also, the Acer Aspire 5742-7120 comes with a CD/DVD RW optical drive and an integrated 1.3MP webcam.

Acer Aspire 5742-7120 Notebook Computer Main Image

Value Notebook Computer Segment

Released

Per press releases, first release in 2^nd half 2010.

Acer Aspire 5742-7120 Notebook Computer - Motherboard Top

Pricing - The Acer Aspire 5742-7120 is listed on various online retailers for as low as $559.

Availability - Assumed global

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 12.7M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Acer Aspire 5742-7120 Notebook Computer - Motherboard Bottom

Acer, according to iSuppli's PC Market Share Q1 2010 database, is ranked as the number 3 notebook PC maker with approximately 10.2 million units shipped worldwide. This gives the Asian PC maker a 13.3 percent market share and a quarter to quarter decline in volume of 6.2%.

Acer Aspire 5742-7120 Notebook Computer Cost Analysis

Acer Aspire 5742-7120 Notebook Computer Cost Analysis

Cost Notes

Main Cost Drivers Representing ~80% of total materials cost

Intel - CP80617004119AL - CPU - Intel Core i3-370M Processor, Dual Cores, 2.4GHz, 3MB L2 Cache, 2.5 GT/s DMI, 32nm Process, 35W

Samsung Semiconductor - M471B5673FH0-CH9 - SO-DIMM DDR3-1333 - 2GB, 256Mbx64, 1.5V (Qty:2)

AU Optronics - B156XW02 V2 - Display Module Value Line Item - 15.6' TN LCD, 1366 x 768 Pixels (HD), 16:9 Aspect Ratio, 0.252mm x 0.252mm Pixel Size, 262K Colors, 500:1 Contrast Ratio, 220cd/m^2 Brightness, 8ms Response Time, Active Area: 344.2mm x 193.5mm, LED Backlight, 3.3V, 5.5W

Western Digital - WD3200BEVT - Hard Drive - 320GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer

Hitachi-LG Data Storage - GT32N - CD/DVD RW Drive - Slim Internal Type, Tray Load, SATA

AS10D51 - Battery Pack - Li-ion, 6-Cell, 10.8V, 4400mAh, 48Wh

Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm Process, 3.5W, w/ Integrated Graphics

HannStar - 6-Layer - FR4, Lead-Free, Halogen-Free

Delta Electronics - ADP-65JH DB - AC Adapter - 19V, 3.42A, 65W, w/ 6ft Cord & Velcro Strap

Broadcom - BCM943225HM - WLAN Half Mini PCIe Module Value Line Item - IEEE802.11b/g/n, 2x2 MIMO, Contains BCM43225

Materials and Manufacturing $392.61

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Acer's Mobile PC manufacturing profile, according to iSuppli's Global OEM Manufacturing and Design Analysis - GOMDA), is 100% outsourced with Compal , Wistron and Quanta, making up 44.2%, 32.6% and 21.9% respectively of their total output capacity.

Country of Origin / Volume Assumptions

Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Acer Aspire 5742-7120 has an overall component count of 1595 (excluding box contents), of which 1192 resides on the motherboard. This level of complexity is on par with comparable notebook computers we have analyzed.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the Acer Aspire 5742-7120 Laptop design:

Display

• Display Module - 15.6' TN LCD, 1366 x 768 Pixels (HD), 16:9 Aspect Ratio, 0.252mm x 0.252mm Pixel Size, 262K Colors, 500:1 Contrast Ratio, 220cd/m^2 Brightness

Motherboard

Chipset

• Platform Controller Hub (HM55 Express Chipset) - Intel - BD82HM55SLGZS, 65nm Process, 3.5W, with Integrated Graphics

CPU

• Core i3-370M Processor - Intel - CP80617004119AL, Dual Cores, 2.4GHz, 3MB L2 Cache, 2.5 GT/s DMI, 32nm Process, 35W

I/O & Interface

• Keyboard Controller - Ene Technology - KB926QF, LPC Interface
• Ethernet Controller - Broadcom - BCM57780A1KMLG,10/100/1000Base-T
• Translator - Texas Instruments - SN75DP139RGZ , DisplayPort to TMDS, Dual-Mode, 2.5Gbps
• Audio Codec - Realtek - ALC272X-GR, 4-Channel, High Definition

Power Supply

• Regulator - On Semiconductor - NCP3218GMNR2G

Clock

• Clock Synthesizer - Silego - SLG8LV597V, for Intel PCI-Express Gen2 Chipset

Memory Module

• SO-DIMM DDR3-1333 - Samsung Semiconductor - M471B5673FH0-CH9, 2GB, 256Mbx64, 1.5V

Communication Modules

• WLAN Half Mini PCIe Module - Broadcom - BCM943225HM

Storage Devices

• Hard Drive - Western Digital - WD3200BEVT, 320GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer
• CD/DVD RW Drive - Hitachi-LG Data Storage- GT32N, Slim Internal Type, Tray Load, SATA

Battery

• Battery Pack - Li-ion, 6-Cell, 10.8V, 4400mAh, 48Wh

Acer Aspire 5742-7120 Notebook Computer - Box Contents