Arivor Technologies, a provider of two-phase cooling solutions and a subsidiary of AEWIN Technologies, will showcase its “2P DLC (Two-Phase Direct Liquid Cooling) Rack-Scale Solution” at COMPUTEX 2026.
Designed for next-generation artificial intelligence (AI) data centers exceeding 100 kW per rack, the solution supports high-power chips beyond 3,000 W and delivers a fully integrated cooling infrastructure from CDU (Cooling Distribution Unit) to critical components. It highlights Arivor’s technological leadership in high-performance thermal integration.
Arivor Technologies participates in the BenQ Group COMPUTEX AI IN ACTION exhibition and exhibits two-phase direct liquid cooling solutions on the 4th floor of Hall 1, Taipei Nangang Exhibition Center from June 2 to June 5, booth number M0104.
Source: Arivor Technologies
“As AI computing demand is growing rapidly, data center power consumption and thermal challenges are escalating at the same pace,” said Feng-Yi Huang, general manager of Arivor. “Competition in the AI era is no longer only about computing power, but also about energy efficiency. Our 2P DLC rack-scale solution is designed to support future chips exceeding 3000 W, which can effectively reduce data center PUE to help customers improve computing performance while achieve energy-saving for ESG goals.”
As AI GPUs and high-performance processors continue to surpass more power consumption, traditional air cooling and single-phase liquid cooling solutions are increasingly unable to balance performance and energy efficiency. Arivor’s 2P DLC rack-scale solution adopts a low-boiling-point coolant phase-change mechanism that leverages the heat generated during liquid-to-vapor transition to significantly improve heat transfer efficiency while reducing overall energy consumption.
Arivor’s 2P DLC rack-scale solution integrates four key technology modules to create a highly integrated liquid cooling infrastructure. The intelligent phase-change CDU serves as the core of the rack-scale liquid cooling system. Featuring pressure regulation and vapor-liquid separation design, the CDU dynamically adjusts refrigerant circulation conditions based on computing workloads to ensure stable operation for each rack supporting cooling capacity up to 200 kW.
The Next-Generation Two-Phase Cold Plate is designed for high-power GPUs and CPUs. Through optimized microstructures, it enhances phase-change efficiency and increases heat exchange surface area to effectively suppress hotspots and maintain system stability under heavy workloads.
The high-reliability manifold system utilizes industrial-grade stainless steel and tuned flow guidance design to ensure even refrigerant distribution across rack nodes while providing high pressure resistance and corrosion durability for long-term operational reliability.
The dry-break quick release connectors are specifically designed for two-phase fluid environments for maintenance under pressurized conditions. It enables “zero leakage” and “zero contamination” which significantly lower operational risks in data centers.
As AI data centers continue evolving toward higher density, greater power consumption and liquid cooling adoption, thermal management capability has become a critical factor in next-generation AI infrastructure deployment. Arivor will continue advancing two-phase liquid cooling technologies across chip-level cooling, rack-scale liquid cooling architectures and operational safety to help customers overcome challenges driven by AI computing expansion and build efficient, stable and sustainable data centers.
