American memory chipmaker Micron Technology Inc. said it plans to build a second cleanroom at its P5 Tongluo, Taiwan, fab after finalizing the acquisition of the facility with Powerchip Semiconductor Manufacturing Corp (PSMC).
Micron said it will begin retrofitting the existing cleanroom this month and the second cleanroom will be built by the end of fiscal 2026.
The new site will complement Micron’s operations in Taiwan extending its campus and be located about 15 miles away. The site includes about 300,000 sq ft of existing 300 mm cleanroom space and will produce leading-edge DRAM, including HBM, for AI applications.
Product shipments from the Tongluo facilities are expected to begin from the existing fab in fiscal 2028. It will expand the site with construction set to begin later this year with the second cleanroom adding about 270,000 sq ft of cleanroom space.
“The Tongluo facility complements our Taiwan operations and is a critical component of our global expansion plans,” said Manish Bhatia, executive VP of global operations at Micron Technology. “Memory is a strategic asset that dictates AI product performance, and the acquisition and phased ramp of this site strengthens our ability to capitalize on these significant opportunities.”
The expansion comes as Micron plans to spend as much as $200 billion in the U.S. to help increase the country’s domestic semiconductor manufacturing capabilities.
In total, the funding will support:
- Two leading-edge memory fabs in Idaho
- Up to four leading-edge fabs in New York
- Expansion of the Virgina fab
- Advanced HBM packaging capabilities
- R&D for future innovation
The investments should generate about 9,000 jobs in the U.S.
