Wired Connectivity

Broadcom unveils Wi-Fi 8 AP and switch

03 February 2026
The BCM49438 Wi-Fi access point and switch targeted for AI-ready enterprise networks. Source: Broadcom

Broadcom has introduced what it claims is the first Wi-Fi 8 access point and switch targeted at AI-ready enterprise networks.

The Wi-Fi 8 access point platform includes Broadcom’s BCM49438 for wireless networking and AI acceleration at the edge. While the Broadcom enterprise-grade switch is powered by Trident’s X3+ BCM56390 and includes Broadcom’s multi-gigabit PHY and power over Ethernet power sourcing equipment (PSE) chips.

Wi-Fi 8 is the latest iteration of the connectivity standard that will increase bandwidth, lower latency and open bandwidth. This will allow data to be used in AI applications and telemetry data for existing networks, Broadcom said.

The Broadcom Wi-Fi 8 platform is a single chip that can be paired with the latest Wi-Fi 8 radio chips allowing OEMs to build complete products that include Wi-Fi 8 end devices to enable:

  • Edge AI processing
  • Real-time optimization
  • Adaptive intelligence across frequency bands

Meanwhile, the Ethernet switch platform powered by the Trident X3+ doubles the front-panel bandwidth to up to 48 multi-gigabit ports to support Wi-Fi 8 deployments. The switch is claimed to be the first to integrate PQC-compliant MACsec across all ports.

It also includes a secure boot engine with hardware root-of-trust. This ensures end-to-end security across the wired and wireless network, Broadcom said.

"Broadcom's new Wi-Fi 8 solution addresses many of the critical challenges facing modern enterprise networks,” said Siân Morgan, research director at Dell’Oro Group. “By taking an end-to-end approach, from the access point to the switch, Broadcom is delivering enhanced network performance and advanced analytics for AIOps. Broadcom’s focus on integrated edge AI, lower-cost- MACsec security, and end-to-end telemetry will result in smarter, more secure, and more cost-efficient networks for enterprises.”

To contact the author of this article, email PBrown@globalspec.com


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