Data centers, particularly those deploying high-density artificial intelligence (AI) servers, face mounting pressure to manage heat efficiently. A liquid cooling technology-based solution has been developed by Panduit to counter this thermal issue.
The Direct-to-Chip (DTC) Cooling System is engineered to deliver scalable thermal management within a
Source: Panduit standard cabinet footprint. The system includes FlexFusion cabinets and rack manifolds that work together to deliver uniform, leak-free liquid cooling directly to the chip. The design enables data center operators to deploy high-density AI servers without compromising space, speed or reliability.
The rack manifold efficiently supplies water for liquid-cooled servers and returns the heated water to a cooling distribution unit. The integrated DTC Cooling System is available in heights of 48 and 52 RU, with 750 mm width and 1,200 mm depth. The cabinet includes a front single-hinged door and rear split-hinged doors with 80% open perforation, horizontally split side panels, PDU mounting bracket and casters. The entire cabinet is electrically bonded without the use of bonding wires.
In addition to helping data centers keep their cool, the compact system frees up cabinet space, which may be used for installing additional components.
