Qnity, a division of DuPont, has launched a new chemical mechanical planarization (CMP) pad platform, dubbed Emblem.
Qnity plans to feature the Emblem CMP platform during SEMICON WEST in Phoenix, Arizona.
The initial product, called Emblem 5171X pad, offers step-out performance and enhanced customization for advanced semiconductor processing nodes. The tool includes multidimensional customization capabilities for higher throughput, planarization and defect reduction, Qnity said.
“The Emblem™ platform is already realizing its potential as a game-changing technology for advanced nodes through the launch of the Emblem™ 5171X pad,” said Randy King, chief technology and sustainability officer-elect for Qnity. “In both internal and customer trials, Emblem™ 5171X is delivering critical improvements in CMP performance and efficiency without giving in to usual tradeoffs — improvements that were not possible with our previous CMP pad platforms. We look forward to continued Emblem™ product development with additional solutions to enable our customers’ next leaps in semiconductor design and manufacturing.”
The move comes as DuPont is planning to spin-off Qnity into an independent, publicly-traded company on Nov. 1, 2025.
Sealing products
Qnity has also introduced three sealing products for semiconductor environments at SEMICON West 2025.
Called Kalrez, the initial products include:
- Kalrez 9400 — A high-temperature grade sealant for harsh process conditions
- Kalrez UPHT — An ultra-pure and high-temperature grade for plasma applications.
- Kalrez PF3 — An engineered, pre-assembled, custom flange fitting sealant.
SEMICON West takes place this week in Phoenix, Arizona.
