Broadband

TechInsights Teardown: Huawei Pura X

26 September 2025

The Huawei Pura X is a foldable smartphone that is powered by HiSilicon’s Kirin 9020 processor. Source: TechInsights The Huawei Pura X is a foldable smartphone that is powered by HiSilicon’s Kirin 9020 processor. Source: TechInsights

Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Deep Dive Teardown of the OnePlus Open CPH2551 Smartphone, click here.

Huawei has been under constant pressure from external countries due to the technology trade war that has been ongoing for the past 5 to 6 years. The Chinese networking equipment giant and consumer electronics device maker has had to turn to domestic Chinese companies for many of its semiconductors to keep up with smartphone advancements.

The Huawei Pura X is the latest flagship product and is powered by the 12-core system-on-chip (SoC) Kirin 9020, Huawei’s proprietary applications/baseband processor that includes an integrated 5G modem and features a Taishan CPU and Arm Cortex-A510 cores.

Huawei said it has sold more than 700,000 units of the Pura X as consumers enjoy the interesting form factor that includes a foldable screen and 16:10 dimensions.

The following is a partial deep dive into the Chinese smartphone conducted by TechInsights.

Summary

  • 16 GB mobile LPDDR5X SDRAM
  • 10.7 MPBSI CMOS, f/2.2
  • 50 MP BSI CMOS (wide-angle), f/1.6, OIS; 8 MP BSI CMOS (Telephoto), f/2.4, OIS, 3.5x Optical Zoom; 40 MP BSI CMOS (ultra-wide-angle), f/2.2, AF; 1.5 MP CMOS Multi-Spectral; LED Flash

Released: March 2025

Pricing: $1,233.58

Target market: Consumer

Availability: China

The main board found inside the Huawei Pura X. Source: TechInsights The main board found inside the Huawei Pura X. Source: TechInsights

Main board

The main board contains the main baseband/applications processor in the HiSilicon Kirin 9020 but also multichip memory of 16 GB mobile LPDDR5X SDRAM. Other components on the main board include:

  • SK Hynix’s 512 GB 4D TLC NAND flash
  • Huaying’s SAW filter
  • ETEK’s Dual SPDT analog switch
  • RichTek’s 250 mA LDO regulator
  • HiSilicon’s Wi-Fi 7/Bluetooth 5.3/GPS and power management ICs
  • OmniVision’s SIM card interface Level translator
  • Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
  • Kinetic Technologies’ 1 A/5 V step-up DC-DC converter
  • SGMicro’s AMOLED display power supply

(Learn more about MEMS on Globalspec.com)

The RF board found inside the Huawei Pura X. Source: TechInsightsThe RF board found inside the Huawei Pura X. Source: TechInsights

RF board

The electronic components found on the RF board include:

  • Huaying’s SAW filter
  • HiSilicon’s LB front-end module and RxD front-end module
  • Maxscend’s SPDT RF switch
  • OnMicro’s quad-band GSM power amplifier module
  • WiPam’s DPDT RF switch

(Learn more about RF chips on Globalspec.com)

The auxiliary board found inside the Huawei Pura X. Source: TechInsightsThe auxiliary board found inside the Huawei Pura X. Source: TechInsights

Auxiliary board

On the auxiliary board of the Huawei Pura X the electronic components include:

  • Maxscend’s Rf antenna tuner
  • Southchip’s 8 amp switched capacitor charger
  • Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
  • WiPam’s RF antenna tuner

(Learn more about chip antenna’s on Globalspec.com)

Some of the electronic components found in the Huawei Pura X smartphone. Source: TechInsights Some of the electronic components found in the Huawei Pura X smartphone. Source: TechInsights

Major components

  • $85.69 — Kirin 9020 Dodeca-core application/baseband processor — HiSilicon (Qty: 1)
  • $81.89 — 120 Hz main display/touchscreen subsystem — Visionox (Qty: 1)
  • $40.11 — 50 MP wide-angle rear camera subsystem (Qty: 1)
  • $37.48 — Multichip memory — 16 GB Mobile LPDDR5X SDRAM (Qty: 1)
  • $29.41 — Multichip memory — 512 GB 4D TLC NAND flash, memory controller (UFS 3.1) — SK Hynix (Qty: 1)
  • $20.91 — 40 MP ultra-wide-angle rear camera subsystem — O-Film (Qty: 1)
  • $16.90 — 120 Hz secondary display/touchscreen subsystem — BOE (Qty: 1)
  • $15.80 — 8 MP telephoto rear camera subsystem (Qty: 1)
  • $12.05 — 10.7 MP front camera subsystem (Qty: 1)
  • $9.50 — Hinge assembly (Qty: 1)


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement