WINSYSTEMS, a developer of rugged embedded computing solutions, announces the addition of two new high-performance embedded computers to its small form factor product lineup: the SBC-472-TS570 and SBC-477-TS570. These new models build upon the proven reliability of the SBC-472 and SBC-477 families, while featuring a more powerful processor for enhanced computing power in industrial applications.
Designed for customers requiring rugged solutions, the SBC-472-TS570 and SBC-477-TS570 deliver
Source: WINSYSTEMS improved processing performance, high-speed connectivity, flexible expansion options and robust thermal management to withstand extreme environments. These new products integrate COM Express Type 6 Basic modules on same-size carriers, ensuring scalability and flexibility for demanding embedded compute projects.
Key features:
• Intel Xeon W-11865MRE Processor — Optimized for high-performance industrial workloads
• Industrial-grade reliability — Reliable, long-life operation from -40° C to 85° C with locking, rugged pin headers
• COM Express type 6 basic size — Small 125 mm x 95 mm modular design for space-constrained applications
• Multiple expansion options — Mini PCIe, USB 3.0, SATA and Gigabit Ethernet for versatile connectivity
• Broad OS compatibility — Works with Linux, Windows 10/11 IoT and other x86 real-time operating systems
“The SBC-472-TS570 and SBC-477-TS570 represent a significant leap forward in the performance of our embedded solutions portfolio,” said Robert Dunaway, chief revenue officer at WINSYSTEMS. “With the Intel Xeon processors, these embedded computers empower customers to implement rugged, high-performance solutions for industrial automation, transportation, and energy applications.”
