Audio and Video

Embedded World 2024: Qualcomm debuts AI-based SBC

09 April 2024
The RB3 Gen 2 single board computer can be used for bringing AI-enabled processing to IoT and embedded applications. Source: Qualcomm

Qualcomm Technologies Inc. will launch its RB3 Gen 2 single board computer (SBC) at this week’s Embedded World 2024, which will bring on-device artificial intelligence (AI), high performance and connectivity to internet of things (IoT) products.

The RB3 Gen 2 uses the QCS6490 processor that supports a 10 times increase of on-device AI processing, support for quadruple 8MP+ camera sensors, computer vision and integrated Wi-Fi 6E.

The SBC is expected to be used in a range of devices like robots, drones, industrial handheld devices, industrial and connected cameras, AI edge boxes, intelligent displays and more.

The developer board includes support for Qualcomm’s AI Hub, a library of pre-optimized AI models for on-device AI performance, memory utilization and power optimized operation.

Qualcomm said this will allow engineers to use a range of models deployed across IoT and embedded applications to help reduce time-to-market and use AI to improve immediacy, reliability, privacy, personalization and cost savings.

Embedded World 2024 takes place this week in Nuremberg, Germany.

To contact the author of this article, email

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter