Qualcomm Technologies Inc. will launch its RB3 Gen 2 single board computer (SBC) at this week’s Embedded World 2024, which will bring on-device artificial intelligence (AI), high performance and connectivity to internet of things (IoT) products.
The RB3 Gen 2 uses the QCS6490 processor that supports a 10 times increase of on-device AI processing, support for quadruple 8MP+ camera sensors, computer vision and integrated Wi-Fi 6E.
The SBC is expected to be used in a range of devices like robots, drones, industrial handheld devices, industrial and connected cameras, AI edge boxes, intelligent displays and more.
The developer board includes support for Qualcomm’s AI Hub, a library of pre-optimized AI models for on-device AI performance, memory utilization and power optimized operation.
Qualcomm said this will allow engineers to use a range of models deployed across IoT and embedded applications to help reduce time-to-market and use AI to improve immediacy, reliability, privacy, personalization and cost savings.
Embedded World 2024 takes place this week in Nuremberg, Germany.
