TechInsights Teardown: Huawei P50 Pocket smartphone
Flip phones have been around since the early days of mobile handsets. While they have fallen out of favor with most consumers that now prefer larger screen OLEDs with all the bells and whistles, Huawei is looking to bring the form factor back into fashion with its P50 Pocket BAL-AL00 smartphone.
The main difference with the P50 Pocket smartphone is that it includes the same electronic components of similar smartphones including an OLED touchscreen and Qualcomm Snapdragon applications/baseband processor. It also includes a slew of main memory from 12 GB mobile LPDDR5 SDRAM and 512 GB of 3D NAND flash.
And the smartphone flips to a small enough form factor to fit inside most pockets. While it may take a while to regain consumer interest in smartphones having the power and similar components of other smartphones integrated into a new flip phone may be a good starting point.
The following is a partial deep dive into the Huawei P50 Pocket smartphone performed by TechInsights.
- 6.9 inch OLED w/ touchscreen
- 1.45 inch OLED
- 12 GB mobile LPDDR5 SDRAM
Target market: Telecommunications
Released: December 2021
At the heart of the P50 Pocket smartphone is the main board that contains the main applications/baseband processor (Qualcomm’s octo-core Snapdragon 888) as well as a pair of multichip memory from SK Hynix (512 GB of 3D NAND flash and 12 GB mobile LPDDR4 SDRAM). However, there are many other electronic components on the board including:
- Power management ICs from Qualcomm
- Audio amplifiers from Goodix
- NFC and secure element chip from NXP Semiconductors
- RF switches and antenna tuner from Qorvo
- Digital barometric pressure sensor from Bosch Sensortec
- Six-axis MEMS gyroscope and accelerometer from TDK InvenSense
- RichTek’s AMOLED display power supply
The interconnect board of the Huawei P50 pocket smartphone is the board that bridges the cameras to the main board and includes the Qualcomm camera power management IC.
The USB board is the control for the connections for the smartphone as well as the sensors for the smartphone. Included on the board are:
- ST Microelectronics’ three-axis MEMS accelerometer
- MEMS microphone from GoerTek
- Maxscend’s RF antenna tuner
- Qorvo’s RF antenna tuner
- $123.48 — Octa-core Snapdragon 888 applications/baseband processor — Qualcomm (QTY: 1)
- $85.54 — 120 Hz main display/touchscreen subsystem (QTY: 1)
- $52.82 — Multichip memory — 512 GB 3D NAND flash memory controller — SK Hynix (QTY: 1)
- $43.91 — Multichip memory — 12 GB mobile LPDDR4 SDRAM — SK Hynix (QTY: 1)
- $35.32 — 40 megapixel true-chrome read camera subsystem — O-Film (QTY: 1)
- $27.10 — 32-megapixel ultra-spectrum rear camera subsystem — O-Film (QTY: 1)
- $17.35 — 13-megapixel ultra-wide/angle rear camera subsystem — O-Film (QTY: 1)
- $13.94 — 10.7-megapixel ultra-wide front camera subsystem (QTY: 1)
- $11.86 — Wi-Fi 802.11 a/b/gln/ac/ax Bluetooth 5.2 — Qualcomm (QTY: 1)
- $11.21 — 60 Hz secondary display/touchscreen subsystem — BOE (QTY: 1)