GainSpan is sampling its new family of GS2000 chips and modules, claimed to be the industry’s first single chip solution that is bringing together two IEEE low power standard wireless technologies. Announced in February, the chip is now entering full production.
The new Wi-Fi/ZigBee IP SoC chip combines Wi-Fi (802.11b/g/n) and ZigBee IP (802.15.4) for new class of battery and line-powered connected devices for the Connected Home, Smart Energy, metering, healthcare and high-speed audio, video and security applications.
By incorporating Wi-Fi and ZigBee, which support both IPv4 and IPv6 devices, the GS2000 extends IP connectivity leveraging the extensive installed base of Wi-Fi access points and hotspots. ZigBee IP extends the reach of IP to more battery-operated devices, through the use of smaller channelization and meshing.
The GS2000 extends GainSpan’s market reach from personal healthcare and fitness and smart energy applications to new segments such as metering and high-quality video and audio applications used in consumer and home automation products.
The integration of Wi-Fi and ZigBee IP will extend IP connectivity to more devices and has the potential to accelerate the Internet of Things, according to Bernard Aboussouan, vice president of marketing at GainSpan.
GainSpan Corp. is a spinoff of Intel Corp. and a member of both the Wi-Fi Alliance and the ZigBee Alliance. GainSpan is backed by Intel Capital and other venture capital investors. (
In June, the company closed a $19 million series D financing round that included two new strategic investors: Zebra Technologies, Corp. which designs and manufactures thermal printers, radio frequency identification products and real-time locating systems; and Oplink Communications, Inc., which designs and manufactures fiber optic products for the telecommunications industry. Oplink has its own photonic foundry facilities in Zhuhai and Shanghai, China serving telecommunications equipment makers.
