Manufacturers of long-lifecycle systems (greater than 15 years) are grappling with supply chain challenges exacerbated by rapid component obsolescence. The COVID-19 pandemic further intensified these challenges, driving an increased demand for and acceptance of components from all available and authorized sources. This is particularly true for devices with older date codes.
Despite the growing consensus that restrictions based on date codes lack a factual foundation, some original equipment manufacturers and contract manufacturers continue to express concerns about
Source: Rochester Electronics soldering aged material onto printed circuit boards.
In this enlightening webinar, Rochester Electronics presents its research findings on the success of board attachment versus the variation in traditional solderability tests for surface mount devices after extended storage periods as called out in the EIA/IPC/JEDEC joint standard J-STD-002.
- Learn how traditional solderability tests may over-reject acceptable aged material.
- Discover an allowable alternative that more closely simulates board attach, providing a practical solution to this supply chain challenge.
- Explore how a long-term storage strategy can ensure a consistent supply chain backed by an in-depth examination of component solderability.
Register to attend this webinar, scheduled for Tuesday, September 10, 2024, at 11:00 AM ET/4:00 PM BST.
