The Texas Institute for Electronics (TIE) at the University of Texas at Austin has been selected by the Defense Advanced Research Project Agency (DARPA) to build an open access R&D and prototyping fab for defense systems.
This could include technology to be used in applications like radar, satellite imaging, unmanned aerial vehicles and other systems.
The project will be a total investment of $1.4 billion with $840 million coming from the DARPA award and a $552 million investment from the Texas government for the TIE semiconductor hub. The facility will be open for use to industry, academia and government as well as create dual-use innovations for the defense sector and the semiconductor industry.
“By investing in leading-edge microelectronics manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and driving innovation in critical technologies,” said John Cornyn, U.S. Senator of Texas. “The next generation of high-performing semiconductors these resources will enable through DARPA’s partnership with UT TIE will help not only bolster our defense but also pave the way for the U.S. to reclaim its leadership role in this critical industry.”
The funding comes from DARPA’s Next Generation Microelectronics Manufacturing (NGMM) program and is part of the university’s 10-year strategic plan to transform UT into a hub for technology like artificial intelligence (AI), robotics, circuit design and other systems development.
So far, TIE’s NGMM team is composed of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.
Two phases
The TIE manufacturing hub will be constructed in two phases, each about 2.5 years in length.
In phase one, TIE will build the center’s infrastructure and basic capabilities. Phase two will focus on the development of 3DHI hardware prototypes important to the DOD and automated processes. This phase will also work with DARPA on separately funded design challenges.
“DARPA’s vision for the NGMM program includes developing an infrastructure that enables users to efficiently and accurately develop advanced microsystems meeting the defense industry’s stringent quality and reliability standards,” said John Schreck, CEO of TIE. “This includes design collateral, EDA tools supporting three-dimensional constructs, and emerging capabilities like digital twins. With the support of our consortium partners, TIE’s product development infrastructure and services will enable a true open access facility where future microsystems can be developed for a wide range of customers and can be leveraged for other programs well into the future.”
