Intel Corp. said it will build a semiconductor assembly and test facility in Wrocław, Poland, investing $4.6 billion.
The facility will be designed to meet critical demand for assembly and test capacity that Intel anticipates in 2027. When completed, the factory will support about 2,000 jobs with construction expected to create an additional thousand jobs.
Intel said the design and planning for the facility will begin immediately with construction to commence pending European Commission approval.
“Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland,” said Pat Gelsinger, CEO of Intel. “It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow.”
With its other investments in Europe, Intel will create what it claims is the first end-to-end leading-edge semiconductor manufacturing value chain in Europe. It will serve as a catalyst for additional investments and innovation in Poland and other parts of the EU, Intel said.
Investment in Europe
Intel has been steadily increasing its semiconductor manufacturing presence in Europe to help extend the supply chain beyond Asia and help increase its foundry business to European fabless companies.
The company became a landowner in Germany with plans to build a semiconductor fab in Magdeburg, Germany. The move continues Intel’s so-called IDM 2.0 strategy, which is a multiyear plan to transform the company back into a manufacturing powerhouse with five process nodes set to be completed in the next four years as well as the construction of at least four to six new fabs.
Additionally, Intel said it was going to build an advanced semiconductor packaging and assembly plant in the northeastern Veneto region of Italy. Among other plans are an R&D hub for HPC and AI in the Plateau de Saclay, France, region and an expansion of manufacturing space at its Leixlip, Ireland, facility.
