Exxelia, a designer and manufacturer of high-performance passive components and subsystems, will be showcasing its latest technological innovations at the Paris Air Show (SIAE- Le Bourget) in Paris, France, from June 19 to June 25. The show will highlight innovations around the aviation of the future through the reduction of the weight and size of components, as well as in other sectors such as space.
Source: Exxelia
On its "Embedded Products" display, bringing together components that can be mounted on satellites, jet fighters or aircraft, Exxelia will be presenting two innovations that are particularly well suited to the challenges of the aviation of the future and the objectives of decarbonization. Its latest film capacitor innovation called MML (named after its "Miniature Micro-Layer" dielectric) shows an energy density up to four times higher than other film dielectrics. MML technology makes power capacitors smaller, lighter and compatible with higher temperatures, and is therefore particularly suitable for DC-Link and decoupling applications.
Alongside MML components, Exxelia will also be exhibiting the latest innovations in magnetic components called “Smart Magnetics.” This novelty is based on the combined design of the inductor together with the transformer as a 2-in-1 component, saving up to 40% in weight and 20% in volume while dissipating more power. Some Smart Magnetics designs are being chosen for electric vertical take-off and landing applications.
