Intel Corp. posted a video focusing on a deep look inside the inner workings of its Oregon D1X semiconductor fabrication facility.
The so-called sub fab, which is one level below the main factory floor, contains tens of thousands of pieces of equipment used to support the 1,200 chipmaking tools in the cleanrooms on the factory floor.
The sub fab contains:
- Pumps
- Transformers
- Power cabinets
- Scrubbers
- Treatments systems
- Conduit cables
The Oregon D1X sub fab is a nearly 700,000 square foot area rarely seen. This is also where extreme ultraviolet (EUV) support machines, air shaft zones and giant pipes are contained.
According to the video, most Intel fabs are made up of four levels: Utility room, sub fab, cleanroom and fan deck. While each Intel fab has a sub fab, the D1X in Oregon is especially large and complex due to the facility not just being a semiconductor manufacturing hub but also an R&D facility.
