Computer Electronics

Mobile World Congress: Intel launches new notebook, server processors

25 February 2022
The Intel Xeon D processor was released at Mobile World Congress 2022 to help with vRAN deployments by telecom operators. Source: Intel

Intel Corp. has unveiled its latest notebook and server processors at Mobile World Congress 2022, which is being held this week in Barcelona.

The company has launched new architectural enhancements and future central processing units (CPUs) in Intel’s Xeon scalable processors, called Sapphire Rapids. Intel also introduced the Xeon D processor and new software modules for enterprise and data centers.

Sapphire Rapids architecture will help with the deployments of vRAN by telecom operators and equipment makers. Intel is working with Samsung, Ericsson, Rakuten Symphony and other leading providers to continue the deployment of vRAN ecosystems using Xeon processors and the future architecture.

Included in this rollout are:

  • 5G-specific signal processing instruction enhancements in the Sapphire Rapids core that will deliver up to two times capacity gains for vRAN and support advanced features such as high-cell density for 64T64R massive MIMO.
  • Sapphire Rapids will be built with new chips that have integrated acceleration that are optimized for vRAN workloads.

Notebook processors

Meanwhile, Intel also introduced its 12 Gen Core P-series and U-series processors for notebook computing. In all, 20 new mobile processors were released to power future generations of laptops. The first devices will be released in March followed by more than 250 notebooks being introduced this year from Aces, Asus, Dell, Fujitsu, Lenovo, LG, MSI, NEC, Samsung and many more.

Intel said the processors are based on its performance hybrid architecture allowing for increased efficiency for video calls, web browsing, photo editing and more.

The processors feature up to 14 cores, integrated Iris Xe graphics with up to 96EU, support for DDR5/LPDDR5 and DDR4/LPDDR4 memory, two times the performance for 3D rendering and up to 30% faster photo editing.

To contact the author of this article, email PBrown@globalspec.com


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