Hprobe, a provider of semiconductor automated test equipment for magnetic devices, successfully demonstrated a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5 µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors. Operating with automated wafer probing stations and external electrical testers, this breakthrough offers significant throughput performance for testing advanced 3D magnetometers. The system presents high flexibility and compatibility with existing end-user platforms and high-volume manufacturing requirements and represents the latest evolution in Hprobe’s unique patented 3D magnetic field generator technology for single and multi-site testing at wafer level, under a magnetic field.
Advanced magnetic sensors are used for various automotive, consumer and industrial applications to extract positioning, angular, strength and direction information. They sense physical parameters using a magnetic field and transmit electrical responses for further processing. To validate these sensors for end applications, they must be tested under extremely demanding and accurate 3D magnetic fields.
Hprobe’s 3D magnetic generator design can be integrated into the company’s existing equipment, which consists of a test head with a robotized 3D magnetic generator. It also includes a field calibration and monitoring system and is designed for interfacing with a currently available electrical tester or provided with a full tester as a turnkey solution. It comes with dedicated software for customers to implement their own tests and to generate custom 3D magnetic field patterns. A wide range of field configurations are available.