Industrial Electronics

Breakthrough in high-volume testing for automotive/consumer advanced 3D magnetic sensors

12 July 2021

Hprobe, a provider of semiconductor automated test equipment for magnetic devices, successfully demonstrated a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5 µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors. Operating with automated wafer probing stations and external electrical testers, this breakthrough offers significant throughput performance for testing advanced 3D magnetometers. The system presents high flexibility and compatibility with existing end-user platforms and high-volume manufacturing requirements and represents the latest evolution in Hprobe’s unique patented 3D magnetic field generator technology for single and multi-site testing at wafer level, under a magnetic field.

Advanced magnetic sensors are used for various automotive, consumer and industrial applications to Source: HprobeSource: Hprobeextract positioning, angular, strength and direction information. They sense physical parameters using a magnetic field and transmit electrical responses for further processing. To validate these sensors for end applications, they must be tested under extremely demanding and accurate 3D magnetic fields.

Hprobe’s 3D magnetic generator design can be integrated into the company’s existing equipment, which consists of a test head with a robotized 3D magnetic generator. It also includes a field calibration and monitoring system and is designed for interfacing with a currently available electrical tester or provided with a full tester as a turnkey solution. It comes with dedicated software for customers to implement their own tests and to generate custom 3D magnetic field patterns. A wide range of field configurations are available.

To contact the author of this article, email

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Find Free Electronics Datasheets