TI grabs Micron’s 300 mm fab for $900 million

09 July 2021

Texas Instruments (TI) has signed an agreement to acquire a 300 mm semiconductor factory from Micron Technology.

The $900 million transaction for the Lehi, Utah, facility will become TI’s fourth 300 mm fab, joining DMOS6, RFAB1 and RFAB2, which will soon be completed.

TI said the acquisition of the fab is a strategic move and the Lehi fab will start with 65 nm and 45 nm production for TI’s analog and embedded processing products. The fab will also be able to move beyond these nodes if required.

The companies plan to complete the sale by the end of 2021 with first revenue from the factory expected to begin in early 2023.

To contact the author of this article, email

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Find Free Electronics Datasheets