Electronics and Semiconductors

Video: Nexperia launches compact half-bridge auto MOSFETs

24 February 2021

Nexperia has introduced a series of half-bridge (high side and low side) automotive metal-oxide semiconductor field-effect transistors (MOSFETs) constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters.

The new package provides a half-bridge solution in one device, occupying 30% lower printed circuit board (PCB) area compared to dual MOSFETs for three-phase motor control topologies due to the removal of PCB tracks, while permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilizes existing high volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection Source: NexperiaSource: Nexperiabetween the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability of 98 A.

Typically, in a half-bridge arrangement, the PCB connection between the source of the high side MOSFET and the drain of the low side MOSFET can create a significant amount of parasitic inductance. However, with its internal clip connection, the LFPAK56D half-bridge package achieves 60% less inductance.
The new LFPAK56D half-bridge MOSFETs launched are the BUK7V4R2-40H and the BUK9V13-40H. Both use the highly robust Trench 9 automotive silicon process technology, are rated at 40 V and are verified at twice the automotive AEC-Q101 specification in key tests. RDS(on) of the devices measures 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13).
The AEC-Q101-qualified Nexperia LFPAK56D half-bridge package suits a broad range of three-phase automotive powertrain applications such as fuel and water pumps, motor control and DC/DC power conversion, occupying 30% lower PCB area and 60% lower parasitic inductance for high performance switching applications. The new technology has already seen success with design-in and commitment from major automotive customers.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement