New Yorker Electronics has announced the global distribution of the newly expanded line of heat sink extrusions from Advanced Thermal Solutions (ATS). The Extrusion Profiles series is comprised of over 200 aluminum alloy extrusions in bar lengths of 300 mm and 1,220 mm. The alloy extrusions are the most cost-effective solution for most electronic cooling applications.
Each heat sink profile is made from single extrusion of aluminum alloy 60601/6063, a high-performance heat conductor. An extensive inventory of profiles in a wide variety of sizes is available. The line features profile 
Source: New Yorker Electronicswidths of 40.9 to 482.9 mm and heights of 9.9 to 72.9 mm. The extrusions have a thermal resistance as low as 0.27° C/W.
The extrusions are provided unfinished (degreased) with custom finishes (anodization) available on request to meet application-specific requirements, and are RoHS compliant.
While most designers find that the standard lengths meet their application needs, New Yorker Electronics will be working with ATS to provide custom profiles as well. In addition, engineers and designers can cut the extrusion bar to the appropriate heat sink design. This also works particularly well for MIL applications that cannot reveal project details. The ATS Extrusion Profile series is also well-matched to Altera, AMD, Freescale, Intel, TI and Xilinx applications.
New Yorker’s heat sink extrusions from ATS do not require an MOQ and no NRE is required, meaning that for standard extrusion profile, New Yorker Electronics is able to fulfill requests quickly.
