Industrial Electronics

Low profile QFN-package power module

09 October 2019

Recom’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile quad-flat no-leads (QFN)-packaged buck regulator power modules. The RPX-2.5 module features flip-chip technology that increases power density and improves thermal management.

The new power module offers a high power density footprint on a 4.5 mm x 4 mm x 2 mm thermally enhanced Source: RecomSource: RecomQFN package. The RPX-2.5 provides an input range from 4.5 to 28 V DC, allowing 5 V, 12 V or 24 V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2 V up to 6 V. The maximum output current is 2.5 A, and the output is fully protected against continuous short-circuits, output overcurrent or over-temperature faults.

It has an efficiency of up to 91%, and it is thermally optimized due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications. To facilitate rapid testing, Recom also offers an evaluation board for this product so that customers will be able to quickly and easily test. Converter samples, evaluation boards and OEM pricing are available from all authorized distributors or directly from Recom.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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