Ironwood Electronics recently introduced a high-performance ball grid array (BGA) socket for 1 mm pitch, BGA 896-pin Xilinx ICs. The CG-BGA-4027 socket is designed for the 31 x 31mm package size and operates at bandwidths up to 27 GHz, with less than 1dB of insertion loss. The socket is designed with an easy-open clamshell lid mechanism which is helpful for high pin-count devices in the socket. The socket also features an integrated compression plate that retains force during various environmental conditions. The socket has heat sink with fan for dissipating 6 W.
The contact resistance is typically 20 milliohms per pin and the socket connects all pins with 27 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB, with no soldering. It uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning.
The CG-BGA-4027 sockets are constructed with high-performance and low-inductance elastomer contactor. The temperature range is -35° C to 125° C. The pin self-inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. Current capacity is 2 A per pin.
