RF & Microwave

IMS2019: Meeting design challenges through Ansys simulation software

28 May 2019

Source: ANSYS Inc.Source: ANSYS Inc.Visitors to the Ansys booth at this year’s edition of the International Microwave Symposium (IMS2019) will have the opportunity to experience what the company says is its industry-leading design flow for antenna synthesis, antenna placement and radio frequency interference (RFI) diagnosis. Attendees will also learn how the company’s high-frequency structure simulator (HFSS) can be combined with thermal and mechanical analysis to create a multiphysics platform for designing mission-critical electronic systems.

“Designing 5G communication systems, advanced driver assistance systems (ADAS), IoT and other high-performance wireless and digital systems is driving high levels of integration, pushing the limits of battery life and continuing the drive to design smaller electronic components,” the company noted on its website. “ANSYS simulation software will help you meet these design challenges.”

Applications include RF/microwave components, signal and power integrity, EMI analysis and electronics reliability.

Ansys will also host several presentations and sessions during IMS, including simulation for 5G design innovation, advanced mmWave radar simulation for enabling safe autonomous vehicles, 3D component modeling for solving RF and microwave design issues and others.

IMS2019 runs June 2-7 in Boston.

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