Discrete and Process Automation

High-definition CMOS Image Sensor Provides Low-cost Machine Vision

31 October 2018

Teledyne e2v, a Teledyne Technologies company and global innovator of imaging solutions, has expanded its Emerald family of image sensors with a new 2 megapixel (MP) sensor. Emerald 2M is a new CMOS image sensor for cost-sensitive applications that require full, high-definition (HD) images of objects in motion, without Source: Teledyne e2vSource: Teledyne e2vdistortion. The sensor is optimized for machine vision applications and includes 5 degree chief ray angle compensation. The Emerald 2M is offered in a high-performance ceramic land grid array (CLGA) package or miniaturized organic fan-out package that is only 1.19 mm thick.

As the smallest full HD global shutter sensor available, Emerald 2M helps lower the cost of a full HD camera system because of its compatibility with low-cost 0.33 in optics.

Emerald 2M provides flexibility to R&D engineers with its global shutter and MIPI CSI-2 interface, which allow it to utilize the latest image signal processors (ISP) available for mobile applications. Digital functionalities (multi region of interest, subsampling, auto exposure at first frame, single frame HDR and on-chip statistics) are also embedded in the sensor to reduce processor load and hasten time-to-market.

The Emerald family of small global shutter CMOS image sensors address a range of machine vision applications and this 2M device has the smallest footprint. Emerald image sensors are also available in resolutions of 8, 12, 16 and 67 MP.

Key features:

  • Global shutter CMOS pixel (2.8 μm x 2.8 μm) optimized for a maximum 5 degree chief ray angle
  • 0.33 in optical format
  • MIPI CSI-2 interface, up to 100 fps
  • Package options: CLGA or fan-out organic package
  • Color filter array options: monochrome or color Bayer
  • On-chip functionalities: multi regions of interest, subsampling, single frame exposure, single-frame high dynamic range

Samples are available in the second quarter of 2019. Please visit the product page for more information. Visit the team at the Vision Stuttgart expo in booth 1F62, Nov. 6-8.

To contact the author of this article, email shimmelstein@globalspec.com


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