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Teardown: Google Pixel 2

30 July 2018
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.
The Google Pixel 2. Source: IHS Markit.

The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Google's Android smartphone released in mid-October 2017 as the successor to the Pixel. The Pixel 2 features a 5 in. display, 12.2 MP and 8 MP cameras, fast-charging battery and built-in Google assistant.

The Google Pixel 2: final assembly, main enclosure. Source: IHS MarkitThe Google Pixel 2: final assembly, main enclosure. Source: IHS Markit

Summary points:

  • Qualcomm Snapdragon 835, Octa-Core 2.45 GHz, MSM8998
  • 4.99 in. AMOLED, 1920 x 1080, with On-Cell Touch
  • 64 GB UFS NAND, 4 GB LPDDR4X SDRAM
  • Intel Tensor processing unit, SR3HX
  • 12.2 MP OIS primary camera, 8 MP secondary camera

Target market: Mass market

Release date: October 2017

Pricing and availability: MSRP $649 USD; worldwide

Total manufacturing cost: $281.21 (incl. direct materials and manufacturing)

The Google Pixel 2: primary camera module (top view). Source: IHS MarkitThe Google Pixel 2: primary camera module (top view). Source: IHS Markit

Major components:

  • Apps/baseband processor, multi-mode, Snapdragon 835, Octa-Core 64 Bit Kryo 280 2.45 GHz CPU, Quad-Core 2.35 GHz + Quad-Core 1.9 GHz, Adreno 540 GPU, 10 nm FinFET, PoP - Manufacturer: QUALCOMM - Manufacturer part number: MSM8998 - (Quantity: 1)
  • 4.99 in diagonal, AMOLED, LTPS, 1920 x 1080, On-Cell Touch, Pentile Matrix, 11 g - Manufacturer: Ssmsung Display Co. Ltd. - Manufacturer part number: AMS499NB01 - (Quantity: 1)
  • Enclosure, main, bottom, machined aluminum, anodized, with injection-molded plastic, with 16 pressed-in threaded metal inserts and 1 brass insert, printed - (Quantity: 1)
  • SDRAM, LPDDR4X-3733, 4 GB, PoP - Manufacturer: Samsung Semiconductor Inc. - Manufacturer part number: K3UH5H50MM-NGCJ - (Quantity: 1)
  • Flash, UFS NAND, 64GB, MLC - Manufacturer: Samsung Semiconductor Inc. - Manufacturer part number: KLUCG4J1ED-B0C1 - (Quantity: 1)
  • Primary camera module, 12.2 MP, BSI stacked CMOS(Exmor RS), 1/2,5 in. format, auto focus lens, optical image stabilization, 6P lens - (Quantity: 1)
  • Tensor Processing Unit (TPU) - Manufacturer: Intel Corp. - Manufacturer part number: SR3HX - (Quantity: 1)
  • RF transceiver, multi-mode, multi-band, GSM/EDGE/CDMA 1X/EV-DO/TD-SCDMA/WCDMA/LTE, with GPS/GLONASS/BEIDOU/GALILEO, 28 nm - Manufacturer: Qualcomm - Manufacturer part number: WTR5975 - (Quantity: 1)
  • Seven-layer, rigid/flex hybrid, FR4/Kapton, 2+3+2, lead-free - Manufacturer: Unimicron Technology Corp. - (Quantity: 1)
  • Fingerprint sensor module, area type, hard coated - (Quantity: 1)

The Google Pixel 2: fingerprint sensor module (top view). Source: IHS MarkitThe Google Pixel 2: fingerprint sensor module (top view). Source: IHS Markit

To contact the author of this article, email tony.pallone@ieeeglobalspec.com


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