Product Watch

With rapid technological advancements, high-tech devices demand increasingly advanced material solutions, particularly in thermal management. Traditional thermal interface materials often face limitations when both thermal conductivity and adhesive properties are required.

EP53TC is a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial.

Thermal double-sided adhesive is a bonding material combining silicone-based materials, thermally conductive ceramic powders, and fiberglass through specialized processing. It is primarily used to enhance the heat dissipation efficiency of electronic components.

In recent years, non-silicone thermal pads have begun to make their mark in the industry. However, their adoption remains relatively slow, with only sporadic applications in certain specialized equipment. Large-scale proliferation still requires time and effort.

As electric vehicles become more prevalent, wireless charging technology has garnered widespread attention. However, the persistent issue of heat generation during wireless charging has long troubled the industry.

Key Features: Rigid bonds Outstanding chemical resistance Optically clear Excellent physical strength properties Passes NASA low outgassing tests Meets FDA Chapter 1, Section 175.105 for indirect food applications

With the rapid development of medical technology, surgery is no longer the frightening taboo it once was. Nowadays, many diseases can be effectively treated through surgery, and with the continuous advancement of minimally invasive techniques, conditions once considered incurable can now be easily treated.

Master Bond EP54TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.