Product Watch

Features Thermal conductivity: 20.0 W/m*K Highly conformable / Dielectric breakdown 8KV/mm Ultra-soft High thermal conductivity Non-flammable interface material. It is excellent for filling small air gaps, making reliable contact with heat source & sink

Features Thermal conductivity: 7.0 W/m.K Low viscosity with Thixotropic characteristics Gel-like material after cured Available for Accelerate cure schedule and Room temperature cured

ALPHA WS-826 is a water-soluble, lead-free, zero-halogen solder paste formula designed for excellent environmental stability. It provides a combination of consistent print performance at elevated humidity conditions, excellent solderability, ease of post reflow residue, consistent stencil life, tack time and print definition. It is classified as ORM0 flux under IPC J-STD-004B.

Superior Thermal Transfer from New Form-In-Place Gap Filler Fujipoly^® America announces the release of its new SARCON^® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating comp...

Sarcon^® GR14B from Fujipoly^® is a low oil bleed/low specific gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is perfect for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thi...

LiPOLY PK404DM is a two-part liquid gap filler for contacting different heights of design gap between the heat source and cooler with a low-pressure application. This gel can be fast cured at room temperature or elevated temperature. It is the best solution for different heights of heat sources or complex shapes and large irregularities in one specific area.

Master Bond EP5G-80 is a one component, graphite filled epoxy paste for bonding, sealing and coating applications. It is electrically and thermally conductive.

Thermal Conductive Putty | LiPOLY Putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our Putty can replace thermals pads in design gaps of 0.1mm-3.0mm. Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the Putty series is 3.5~8.0 W/m*K.