Aerospace

Chip Bead and Inductors Have Durable Soft Termination

22 March 2017

KMZ1608 and KPZ1608 series chip beads. Source: TDK.  KMZ1608 and KPZ1608 series chip beads. Source: TDK. TDK Corporation has introduced reportedly the first multilayer chip beads and inductors with the soft-termination technology that is already proven in TDK MLCCs. The external electrodes of the KMZ1608 and KPZ1608 series of chip beads and the KLZ1608 and KLZ2012 series of inductors feature a conductive resin layer that offers effective protection against board flexure and solder cracks due to mechanical stress during mounting and thermal shock during operation.

As a result, these soft-termination automotive-grade components offer high reliability under harsh conditions, even at high operating temperatures up to 150° C. They are thus suitable for demanding automotive applications, such as engine control modules (ECMs) and various in-vehicle electronic control units (ECUs), and advanced driver assistance systems (ADAS), as well as in a variety of industrial equipment.

The KMZ1608 and KPZ1608 series of chip beads are available in IEC 1608 case size with dimensions of 1.6 mm x 0.8 mm x 0.8 mm. The KLZ1608 and KLZ2012 series are available in IEC 1608 and 2012 case sizes and measure in at 1.6 mm x 0.8 mm x 0.8 mm and 2.0 mm x 1.25 mm x 1.25 mm, respectively. The lineup of multilayer chip beads and inductors with soft terminations will be continuously expanded to include smaller case sizes.

Specifications for the KMZ1608 chip beads include DC resistance of 0.1 to 0.8 Ω, rated current of 200 to 800 mA, and impedance of 50 to 2,500 Ω. The KPZ1608 chip beads exhibit DC resistance of 0.015 to 0.3 Ω, rated current of 800 to 5,000 mA, and impedance of 30 to 1,000 Ω.



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