The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch, or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85 Ω and 100 Ω systems due to targeting the 92 Ω specifications and controlling reflections at all geometry transitions within the connector.
Samtec’s ExaMAX® system has reportedly the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability, while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.
The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. The 2.00 mm-pitch, 40-differential-pair design (4 pairs × 10 columns) and the 72-differential-pair design (6 pairs × 12 columns) are now available. A 3.00 mm-column-pitch design for 56 Gbps performance is in development.
Optional add-on power modules support high current delivery with current ratings as high as 80 A per module. Hot-swapping support comes from various pin staging options for detecting shorts. Optional discrete guidance modules are available to assist with blind mating. Ruggedized construction enables support for maximum weight in a space-saving design.