Semiconductors and Components

Qualcomm and TDK Form JV for IoT

18 January 2016

Qualcomm Inc. and Japanese chipmaker TDK Corp. have formed a joint venture to develop RF front-end (RFFE) modules and RF filters for mobile devices, the Internet of Things (IoT), drones, robotics, automotive applications and more.

The JV will be called RF360 Holdings Singapore PTE. Ltd. and will merge TDK’s micro-acoustic RF-filtering, packaging and module integration with Qualcomm’s wireless semiconductor technology. The agreement is expected to be closed by early 2017 pending normal regulatory approvals.

In addition to the JV, Qualcomm and TDK have agreed to cooperate on a wide range of technologies for next-generation mobile communications, IoT and automotive applications including passive components, batteries, wireless charging, sensors, MEMS and more.

RF360 Holdings will be initially owned by Qualcomm with 51% and 49% by EPCOS AG, a wholly-owned subsidiary of TDK. Filter and module design and manufacturing assets will be carved out from TDK and its subsidiaries and be largely acquired by RF360 Holdings with certain assets being acquired directly by Qualcomm. Qualcomm has an option to acquire the remaining interest in the JV 30 months after the closing date.

To contact the author of this article, email PBrown@globalspec.com


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