Mobile Devices

Huawei C8813 Mobile Handset Teardown

31 May 2013
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Summary Points

4.5' IPS Panel based smartphone
Available exclusively through China Telecom
Android 4.1.1 OS (Jelly Bean)
Qualcomm MSM8625 Core (S4 SnapDragon 1.2GHz)
Dual-SIM Card

Huawei C8813 Mobile Handset Main ImageHuawei C8813 Mobile Handset Main Image

Target Market

Entry-Level Smartphone

According to press articles - though pricing not published, the C8813 is an 'affordable price' smartphone.


January 2013 Press release date (CES 2013)

Huawei C8813 Mobile Handset - Main PCB BottomHuawei C8813 Mobile Handset - Main PCB Bottom

Pricing and Availability

890 RMB Based on selling price

ASPs always vary from country to country based on local currencies.

Entry-level smartphone

China and other international markets.

Volume Estimations

4,000,000 Annual Production Volume
1.5 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 4000000 units and a Product Lifetime Volume of 1.5 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Huawei C8813 Mobile Handset Cost AnalysisHuawei C8813 Mobile Handset Cost Analysis

Cost Notes

Total BOM: $98.04
Top Cost Drivers below: $71.54
% of Total BOM 73%

Main Cost Drivers below

Tianma - TM045YDZP00 Display Module - 4.5' Diagonal, 16.7M Color TFT (IPS Mode), 854 x 480 Pixels, 116.5um x 116.5um Pixel Size, 99.50mm x 55.93mm Viewable Area- (Qty: 1)
Qualcomm - MSM8625A Apps / Baseband Processor - Multi-Mode, GSM/EDGE/WCDMA/CDMA/EVDO Rev B, gpsOne, Dual-Core ARM Cortex A5 1.2GHz, Adreno 203 GPU- (Qty: 1)
Samsung Semiconductor - KMSJS000KM-B308 MCP - 4GB eMMC NAND + 512MB Mobile DDR- (Qty: 1)
O-Film - Display Window / Touchscreen Assembly - 4.5' Diagonal, Capacitive, Glass-Film-Film Type, w/ Corning Gorilla®Glass2 Cover Glass- (Qty: 1)
Primary Camera Module - 5MP, FSI CMOS, 1/4' Format, Auto Focus Lens- (Qty: 1)
Compeq - 10-Layer - FR4/RCF HDI, 2+6+2, Stacked Via, Lead-Free- (Qty: 1)
Qualcomm - RTR6285A RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS/HSPA Transceiver w/ Rx Diversity, w/ Integrated GPS Receiver & Rx Diversity, 0.18um RF CMOS- (Qty: 1)
Huawei - HB4W1 Battery - Li-ion, 3.7V, 1700mAh- (Qty: 1)
Qualcomm - RTR6500 RF Transceiver - CDMA2000 1X / EVDO, w/ Integrated GPS Receiver & Receive Diversity, 0.18um RF CMOS Process- (Qty: 1)
Huntkey - Charger - 5V, 1A, AC to USB Type A- (Qty: 1)

Huawei C8813 Mobile Handset - Disassembly View 1Huawei C8813 Mobile Handset - Disassembly View 1

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - China
Camera Assembly - China
Display / Touchscreen - China
Main PCB - China
Misc PCB Assemblies - China
Other - Enclosures / Final Assembly - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 662 - Main PCB
Component Qty: 11 - Display / Touchscreen
Component Qty: 13 - Box Contents
Component Qty: 54 - Camera Assembly
Component Qty: 76 - Other - Enclosures / Final Assembly
Component Qty: 21 - Misc PCB Assemblies
Component Qty: 837 - Grand Total

The average smartphone has about 1000 components making this device relatively simple to produce.

Huawei C8813 Mobile Handset - Box ContentsHuawei C8813 Mobile Handset - Box Contents

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