Acquired Electronics360

Gigabyte H67MA-UD2H-B3 Motherboard Teardown

09 September 2011
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Gigabyte GA-H67MA-UD2H-B3 is a micro ATX form PC motherboard that features the H67 Express Chipset solution. The GA-H67MA is designed to support Intel Core i7, i5 and i3 processors with the LGA1155 package and up to 32GB of system memory on DIMM expansions. The motherboard has support for integrated graphics support HDMI, Displayport and DVI output as well as high definition audio via the Realtek ALC889 audio codec.

Gigabyte H67MA-UD2H-B3 Motherboard Main Image
Target Market

PC Manufacturers



Pricing and Availability

Pricing - The Gigabyte motherboard sells through retail channels for as low as $130

Availability - Global

Volume Estimations

For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 1M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Gigabyte H67MA-UD2H-B3 Motherboard Cost AnalysisGigabyte H67MA-UD2H-B3 Motherboard Cost Analysis

Gigabyte H67MA-UD2H-B3 Motherboard Cost Analysis
Cost Notes

Main Cost Drivers ~68% of Total Materials Cost

Intel - BD82H67SLJ49 - Platform Controller Hub - H67 Express Chipset, 65nm

Vishay - Siliconix - SiC769CD - PWM MOSFET Module - Integrated Dual N-Channel MOSFETS & Driver (Qty:10)

Chuan Yi Computer - 4-Layer - FR4, Lead-Free, Halogen-Free

Lotes - CPU Socket - LGA1155, w/ Bottom Plate, Hardware, Metal Lever Lock & Cover

Intersil - ISL6617CRZ - Phase Doubler - for DC-DC Converter, Single PWM Input to Dual-Phase Output (Qty:5)

Lotes - Memory Socket - DIMM, DDR3, 1.5V (Qty:4)

Renesas - uPD720200 - USB Host Controller - 2-Port, USB 3.0

Nichicon - PLF0J561MCO - Electrolytic Aluminum Conductive Polymer - 16V, 560uF, 105C, 20%, Low ESR (Qty:7)

Inductor - Wound Ferrite Core, Shielded (Qty:12)

Foxconn - Combo Jack - 2xUSB 3.0 / RJ45, Stacked, Right Angle, w/ 2 LEDs & Metal Housing

SATA Cable - w/ 2 7-Position SATA Data Connector & Lock (Qty:4)

Nichicon - PLF0E821MCO - Electrolytic Aluminum Conductive Polymer - 2.5V, 820uF, 105C, 20%, Low ESR (Qty:15)

Macronix - MX25L3206EH2I-12G - Flash - NOR, 32Mb, SPI, 86MHz (Qty:2)

Heatsink - Extruded / Machined Aluminum, Anodized, w/ 2 Spring-Loaded Plastic Mounting Pins, 1 Screw, & Thermal Transfer Material

Heatsink - Extruded / Machined Aluminum, Anodized, Printed, w/ 2 Spring-Loaded Plastic Mounting Pins, 1 Screw, Thermal Transfer Material

Intersil - ISL6364CRZ - Regulator - DC-DC Controller, 4+1-Phase, PWM, for VR12/IMVP7

Direct Materials + Manufacturing $103.14

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on device markings, we've based our analysis with the final assembly in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Ethernet connectors), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Gigabyte microATX motherboard has an overall component count of 1713(excluding box contents). In comparison, the comparable H67 chipset motherboard from Intel has an overall component count of 1429 which most of the differences made up in power supply related components.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.


Gigabyte H67MA-UD2H-B3 Motherboard - Box ContentsGigabyte H67MA-UD2H-B3 Motherboard - Box Contents

Gigabyte H67MA-UD2H-B3 Motherboard - Box Contents

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