Nokia N82 Mobile Phone Teardown

Overview / Main Features

The Nokia N82 is a mid-tier camera phone within the N-Series range of premium handsets from the Finnish maker. The N82 has the distinction to be the first Xenon-flash based 5 mega-pixel camera phone design from Nokia release late in 2007. Comparatively, the N82 represents the most dated model in this 6 handset comparative teardown analysis.

Like its predecessor, the flagship Nokia N95, the N82 is a true smart phone (Symbian S60) with a 5 mega-pixel camera with Carl Zeiss optics, integrated WLAN and aGPS with pre-installed Nokia Maps application. This single-band UMTS/HSDPA (2100MHz) and quad-band GSM/EDGE candy bar phone is more a demonstration in packing as many high-end features into a small device than it is any radical design innovation as with the N95.

Arguably, the N82 is the best all-around performer in the N-series range as a camera phone. The device is packaged with a 2GB microSD and a maximum capacity of 8GB of external storage. The auto-rotating 2.4 inch primary display renders full 16M colors in QVGA format.

Nokia N82 Mobile Phone Main Image

Mid to High-end 'smartphone' handset targeting rich multi-media orientated mobile phone consumers

Released

Per press releases, first launched into select world markets on November 14th, 2007.

Nokia N82 Mobile Phone - Main PCB Top

Pricing - The N82 is available through various high-end boutique mobile phone e-tailors as well as through US based Nokia stores. Handset price ranges between $440 to about $520 at the time of writing (August 2008). However, if the phone is sold through a network carrier in select global markets, the cost may be significantly reduced due to service provider subsidies.

Availability - The Nokia N82 handset is currently available in through carriers in select global markets such as Europe and Asia that support the 2100MHz UMTS/HSDPA frequency. Also, the Nokia has made available the handset to other GSM coverage markets such as the US without network contracts.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 8.9M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Incremental changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.

Nokia N82 Mobile Phone - Main PCB Bottom

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

iSuppli estimates unit shipments of 168 million HSDPA handsets in 2008 global market. We further estimate 40 million units of 5 megapixel camera phones to ship in the 2008 global market. All estimates are based on a 2 year product life span assumption with an overall global market share of 38% for Nokia.

Nokia N82 Mobile Phone Cost Analysis

Primary Camera Module Value Line Item - 5.0MP, CMOS, 1/2.5'' Format, Auto Focus Lens

Texas Instruments - OMAP2420 - Applications Processor - OMAP, ARM11 Core, TMS320C55x DSP, Graphics & Imaging Accelerator, PoP

Texas Instruments - NMP #4377476 - DBB - Digital Baseband Processor

ACX556AKM-6 - Display Module Value Line Item - 2.4'' Diagonal, 16.7M Color TFT, 240 x 320 Pixels

Samsung Semiconductor - KAT00F00RA-D477 - MCP - 2Gb OneNAND Flash, 512Mb Mobile DDR, PoP

Texas Instruments - OMAP-DM290ZWV - Applications Processor - OMAP, Image Processing

MicroSD Memory Card - 2GB, w/ SD Adapter in Plastic Case

ST Microelectronics - STLC4560 - WLAN - Single Chip, IEEE802.11b/g

UniMicron Technology - 10-Layer - FR4/RCF HDI, 3+4+3, Stacked Via

Nokia - BP-6MT - Battery - Li-Polymer, 3.7V, 1050mAh

4-Layer - Rigid/Flex Hybrid, HDI, RCF/Kapton, 1+2+1

Spansion - S72NS128ND0AJW13 - MCP - 128Mb NOR Flash, 128Mb Mobile DDR

Texas Instruments - GPS5300 - GPS - Single-Chip, A-GPS, NaviLink 4.0

Murata - Bluetooth/FM Radio Combo Module - Contains NXP TEA5761UK & CSR BC41B14 BlueCore4 Bluetooth V2.0 EDR

ST Microelectronics - NMP #4380206 - RF Transceiver - Quad-Band GSM/GPRS/EDGE, WCDMA 850/2100

Secondary Camera Module Value Line Item - CIF, CMOS, 1/13.2'' Format, Fixed Lens

RF Micro Devices - NMP #4355951 - PAM - Quad-Band, GSM/GPRS/EDGE w/ Integrated SP7T Antenna Switch

ST Microelectronics - NMP #4396299 - ABB - Analog Baseband / Power Management

Texas Instruments - TWL92230CZQE - Power Management IC

Samsung Semiconductor - K4M28163PH-KG750 - Mobile SDRAM - 128Mb (2M x 16Bit x 4 Banks), 1.8V

Total BOM & Manufacturing Costs (Direct Materials + Conversion Costs) $149.93

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

According to iSuppli's 'Global OEM Manufacturing and Design Analysis - Mobile Handsets Q1 2008', Nokia conducts much of the final assembly in-house throughout their various global operations while utilizing EMS providers to source mobile handset modules and sub-assemblies. iSuppli estimates that nearly 60% of the sub-assemblies in handsets produced in 2007 were produced by their contract manufacturers.

Nokia maintains worldwide manufacturing operations in North America (Mexico), South America (Brazil), Asia Pacific region (Korea), Greater China, India and 4 other locations in both Eastern and Western Europe. iSuppli estimates that Nokia used 5 EMS providers in 2007 with Foxconn, Elcoteq and Jabil making up roughly 20% of Nokia's overall manufacturing capacity.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Finland. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were sourced in lower cost regions within Eastern Europe.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as the LCD), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. 'Auto' inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

Nokias, as a general rule, have fewer discrete mechanical and electronic components, for the same amount of functionality than their competitors. Furthermore, Nokia have a very modular approach to designs which make them simpler to manufacture, improving production cycle times and ease of re-work. The Nokia N82 has a component count of 759 (excluding box contents), of which, 184 are mechanical in nature. This device complexity is on par with other 3.5G handsets in this comparative analysis.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Europe.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Nokia N82 Mobile Phone - Enclosure Disassembly

Design Notes

Here is a summary of the major components used in the Nokia N82 design:

Main PCB

MPU / Memory

Applications Processor - Texas Instruments - OMAP2420

Digital Baseband

Digital Baseband Processor - Texas Instruments - NMP #4377476

Analog Baseband / Power Management

ABB - ST Microelectronics - NMP #4396299

Power Management IC - Texas Instruments - TWL92230CZQE

Power Management - Battery Charger IC - ST Microelectronics - NMP #4376535

Memory

Flash & Mobile DDR - Spansion - S72NS128ND0AJW13

RF Transceiver

RF Transceiver - ST Microelectronics - NMP #4380206

Power Amplifier

PAM - RF Micro Devices - NMP #4355898

PAM - RF Micro Devices - NMP #4355951

WLAN

WLAN - ST Microelectronics- STLC4560

User Interface

Applications Processor - Texas Instruments - OMAP-DM290ZWV

Bluetooth/FM Radio Combo Module - Murata

Contains: NXP TEA5761UK & CSR BC41B14 BlueCore4 Bluetooth V2.0 EDR

Piezo Motor Driver - Analog Devices - AD5801

GPS

GPS -Texas Instruments - GPS5300

Camera

Image Sensor - 5.0 MP, CMOS - Aptina - MT9P001I12STC

Display

Display Module - 2.4'' Diagonal, 16M Color TFT, 240 x 320 Pixels

Nokia N82 Mobile Phone - Box Contents