Brewer Science, Inc., a developer of materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26 to May 29, 2026, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida.
Brewer Science will exhibit at Booth #511 and is proud to serve as a Gold Sponsor of ECTC 2026. Company experts will be available throughout the conference to discuss materials-driven solutions that enable next-generation heterogeneous integration, high-bandwidth memory for artificial intelligence (AI) and high-speed digital applications.
Brewer Science researchers and technology leaders will contribute to the ECTC technical program with two presentations and participation in a special materials innovation panel.
Special session panel
Source: IEEE
Special session 8: Innovative Materials for Advanced Packaging — Materials for Packaging, Integration and Performance
Panelist: Rama Puligadda, Chief Technology Officer, Brewer Science
Date and time: Tuesday, May 26 | 3:30 PM
Location: Palazzo E
This special session will explore the necessity and “must-have” attributes of innovative materials across substrates, RDLs, hybrid-bonding dielectrics, interposers and chiplet integration to address performance, scalability and cost challenges in advanced packaging.
Oral presentation
Thin Cleanable Organic Laser Release Layer with Ultralow Laser Transmittance Below 360 nm Wavelength for TBDB
Presenter: Hanlin Chen, Ph.D., Research Scientist Team Lead, Brewer Science
Date and time: Thursday, May 28 | 4:05 PM
Location: Tuscany D | Session 21
This presentation introduces a novel cleanable organic laser release layer (LRL) designed to address critical challenges in temporary bonding and debonding (TBDB) for ultrathin wafers and large-area fan-out packaging. The material demonstrates strong UV absorption with less than 1% transmittance at film thicknesses of 600 nm, enabling low-dose laser debonding while minimizing residue, particles and device-side damage. The cleanability of the film using common solvents supports contamination reduction and carrier reuse in advanced manufacturing environments.
Interactive presentation
Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferable Cu/Polymer Hybrid Bonding for High-Speed Digital Applications
Co-presented by: Brewer Science and ITRI
Date and time: Thursday, May 28 | 10:00 AM
Location: Mediterranean Hallway | Interactive Presentations
This work presents a novel 3D vertical stacking architecture featuring hierarchical multi-layer stacking vias, through-molding vias (TMVs) and transferred copper/polymer hybrid bonding. Using Brewer Science’s low-Dk, low-Df dielectric materials combined with nanocrystalline copper, the approach enables low-temperature (150° C) hybrid bonding, fine-feature RDLs and electrically optimized interconnects tailored for AI and high-speed digital applications.
Visit Brewer Science at Booth #511
Conference attendees are invited to visit Booth #511 to learn how Brewer Science materials enable scalable manufacturing, improved yield and robust performance for advanced packaging, panel-level processing and heterogeneous integration.
