In a bid to advance scalable electronically steerable array (ESA) technology, Sivers Semiconductors AB and materials maker Doosan Corp. are collaborating to develop ESA panels in the Ka-ban for satellite communications (SATCOM).
Under the deal, the companies will design and develop advanced antenna systems that will be powered by Sivers’ Ka-band SATCOM beamforming integrated circuits (BFICs).
The collaboration will help to expand Sivers’ footprint in the global SATCOM market “enabling multi-beam, multi-orbit connectivity” used in future space systems and Doosan’s capabilities will help to “achieve new levels of scalability and reliability in ESA architectures” said Vickram Vathulya, CEO of Sivers Semiconductors.
The collaboration
The deal will see Sivers supply its Ka-band SATCOM BFICs that will enable simultaneous multi-beam operation, allowing communication with multiple satellites across multiple orbits. It will also support make-before-break handovers for uninterrupted connectivity for both fixed and mobile SATCOM terminals.
Sivers will also develop the ESA panels using its in-house design capabilities.
Meanwhile, Doosan will manufacture and system test the ESA panels allowing them to be scalable from smaller, low-power terminals all the way to larger, high-performance gateways.
The companies said this will serve different types of SATCOM systems as demand increases.
The collaboration is the first in a broader partnership between Sivers and Doosan designed to support Korea’s emerging SATCOM infrastructure including advanced antenna technologies.
