MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistries to the electronics industry, has introduced MacuSpec VF-TH 500. This high-performance via filling and simultaneous through hole acid copper electroplating process is designed to enable increased reliability of complex, high density interconnect (HDI) printed circuit boards (PCBs) for next-generation technologies.
Meeting industry demands
The growth in high-performance servers for artificial intelligence (AI) applications, advanced automotive systems and high-speed networking infrastructure is driving the demand for more complex, multilayer boards that must meet stringent reliability and performance requirements. MacuSpec VF-TH 500, the latest innovation in MacDermid Alpha’s award-winning MacuSpec VF-TH series, provides fabricators and OEMs with a versatile solution to meet these requirements.
Enhanced performance and versatility
MacuSpec VF-TH 500 enables more complex board designs in applications such as mSAP, high-reliability automotive and high-performance computing. Source: MacDermid Alpha Electronics Solutions
MacuSpec VF-TH 500 is designed for HDI boards that require simultaneous via filling and through hole plating with excellent microdistribution for panel plating and modified semi-additive processing (mSAP) pattern plating. The chemistry provides high via filling performance for via sizes up to 200 µm x 100 µm. Fabricators can expect a reliable deposit and improved throwing power at the knee and through hole.
Expert insights
“To meet the reliability and performance requirements for high-density interconnects, fabricators are often faced with challenges associated with large vias and complex via structures,” commented Dr. Kesheng Feng, director of metallization research at MacDermid Alpha.
“MacuSpec VF-TH 500 delivers outstanding results for mSAP with minimal copper addition to the surface. This enhances line/space reduction, boosts circuit density, and improves signal transmission. The process is highly versatile, meeting the needs of advanced fabricators.”
Key benefits for fabricators
MacuSpec VF-TH 500 offers fabricators the following process benefits:
- Panel, pattern or button plating capability.
- Compatible with VCP or vertical hoist equipment.
- Flexible options for both insoluble and soluble anode systems.
- Works seamlessly with direct metallization or electroless copper, ensuring reliable microvias with epitaxial growth across the interface.
