Industrial Electronics

Explore Menlo Micro's Ideal Switch at PCIM 2025

02 May 2025

Menlo Micro will be exhibiting at the PCIM Expo & Conference in Conference in Nuremberg, Germany, the leading international event for power electronics, intelligent motion, renewable energy and energy management. Visit booth 4A-319 during May 6 to May 9 to experience interactive demos of the Ideal Switch platform delivering transformative impact on customer power applications.

Discover the efficiency of Menlo Micro’s MM9200 compared to conventional solid state relay (SSR) and electromechanical relay (EMR) solutions. This demo showcases real-time power usage, annual energySource: Menlo Microsystems, Inc.Source: Menlo Microsystems, Inc. consumption and cost savings across various applications.

The MM9200-based relay is 86% more efficient than traditional EMRs and 96% more efficient than SSRs. Its compact design eliminates bulky heatsinks at these current levels, simplifying on-board monitoring of voltage, current and temperature. Watch a hybrid setup — featuring two MM9200 switches alongside an EMR and an SSR — control a 12.5 A load in series, with key metrics captured live.

The demo at the PCIM Expo & Conference will compare the MM9200 to SiC metal-oxide semiconductor field-effect transistors (MOSFETs) using the same board form factor — without heat sinks — focusing on their performance in a 240 V AC application, particularly in enclosed structures like circuit breakers where temperature rise is a concern.

Menlo engineers will present on-state resistance and temperature readings for two boards: one featuring 12 parallel and two series MM9200 devices, and the other with four parallel and two series silicon carbide (SiC) MOSFETs, both rated for 40 A.

In the same available space, a Menlo switch-based solution operates at a much lower temperature and can handle substantially higher currents compared to a SiC solution. Alternatively, users could design a more compact system that manages the same current as a SiC solution.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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